Nordson Corporation

James Scott Tyler

Robert Sergei Condrashoff

James Donald Getty

Thomas V Bolden, Ii

James P Fazio

David Eugene Hoffman

Robert Sergel Condrashoff

Ii Thomas V Bolden

Thomas V Bolden Ii

A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasma cavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.

Plasma treatment system

Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.

Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

An apparatus for processing a substrate with a plasma. The apparatus includes first and second electrodes positioned with a spaced apart relationship. A separating ring has a vacuum-tight engagement with confronting surfaces of the first electrode and the second electrode to define an evacuatable processing region therebetween. Communicating with the processing region is a process gas port for introducing a process gas to the processing region. The processing region may be evacuated through a vacuum port defined in one of the first and second electrodes to a pressure suitable for exciting a plasma from the process gas in the processing region when the first and second electrodes are powered.

Ultra high speed uniform plasma processing system

A plasma treatment system () and related methods for rapidly treating a workpiece () with ions from a plasma having an ion density that is reproducibly uniform and symmetrical. The processing chamber () of the plasma treatment system () includes a chamber () lid having a symmetrical array of apertures () and further includes a vacuum distribution baffle (), which are both configured to uniformly disperse a process gas adjacent the surface of the workpiece (). The uniform dispersion of process gas and a symmetrical placement of the workpiece within the chamber () contribute to providing a uniformly dense plasma of ions adjacent the workpiece (). A treatment system control () automates the operation of the system and controls the flow of process gas, evacuation of the chamber, and the application of the plasma excitation power to minimize the length of a treatment cycle and to optimize the uniformity of the plasma treatment.

High-speed symmetrical plasma treatment system

A plasma treatment system in which untreated workpieces are serially received one at a time on an infeed table but stored in parallel on the infeed table. The untreated workpieces are transferred simultaneously, in parallel, into a plasma treatment chamber. Thereafter, treated workpieces are transferred simultaneously, in parallel, out of the plasma treatment chamber onto an outfeed table; and the outfeed table serially discharges the treated workpieces one at a time from the outfeed table.

Material handling system and method for a multi-workpiece plasma treatment system

A plasma treatment system wherein workpieces are carried in slots in a magazine. The plasma treatment system has first and second plasma treatment chambers mounted on a common base a base. A queuing station is located on the base for receiving the magazines. A magazine handler moves a magazine to a location adjacent one of the first and second plasma treatment chambers. A workpiece handler transfers a workpiece between the magazine and the one of the first and second plasma treatment chambers. The workpiece handler has a workpiece translator with a first surface that contacts a first edge of the workpiece for pushing the workpiece into the plasma treatment chamber. In addition, the workpiece translator has a second surface that contacts an opposite edge of the workpiece for pushing the workpiece out of the plasma treatment chamber. There are various methods relating to the use of multiple plasma treatment chambers on a single base and the automatic handling of workpieces for loading and unloading the multiple plasma treatment chambers.

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Galt, CA, United States of America

James Scott Tyler