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Speedfam-ipec Corporation

Speedfam Corporation

James Schlueter

Chris E Karlsrud

Thomas K Crosby

Lorri J Schlueter

Clinton O Fruitman

Paul L Holzapfel

John Natalicio

Inki Kim

Warren Lin

A carrier for semiconductor wafers to be polished comprises a backing pad vulcanized to a pressure plate. The backing pad is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive film of a thermosetting, thermally reactive material forms an integral bond between the backing pad and pressure plate. The backing pad, adhesive film and pressure plate together comprise a nearly ideally elastic assembly. The exposed face of the backing pad is profiled to a desired profile without effecting crumbling of the rubber material.

Method for manufacturing a workpiece carrier backing pad and pressure

A carrier for semiconductor wafers to be polished comprises a rigid upper housing, a rigid pressure plate and a gimbal mechanism connecting the plate and housing which permits the plate to gimbal or wobble relative to the housing. The pressure plate is a one-piece component and has a central cut-out portion in which the gimbal mechanism is disposed, thereby establishing a low gimbal point and reducing the incidence of tilting. The gimbal mechanism has an inner bearing ring which is fastened to the underside of the housing, and an outer bearing ring which is fastened to an outer portion of the pressure plate.

Workpiece carrier with monopiece pressure plate and low gimbal point

The present invention provides methods and apparatus which permit the in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a work piece, e.g., a semiconductor wafer. A probe is disposed proximate to the outer perimeter of a polishing pad on a CMP table such that the probe establishes optical contact with the wafer surface as a portion of the wafer extends beyond the outer perimeter of the polishing pad. A nozzle may be provided to apply a stream of compressed air at the disk surface under inspection to thereby remove excess slurry from the local region of the workpiece being inspected. A broad band light source is employed in conjunction with a fiber optic cable to direct light at the wafer surface. A bifurcated probe is employed such that the light applied to the workpiece surface is reflected back to and captured by a corresponding optical sensor connected to a fiber optic cable. The captured reflected light received by the receptor sensor and fiber optic cable assembly is applied to a photospectrum meter which analyzes the reflected light. An output signal from the photospectrum meter is transmitted to a processor which includes a smart algorithm configured to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer.

Methods and apparatus for detecting removal of thin film layers during

An agricultural irrigation system comprised of a plurality of unit pipes which constitute a water supply pipe line and another plurality of unit pipes which constitute a plurality water dispensing line each of whose respective pipe units are connected to respective center, valve/connectors which couple successive pipe units of the water supply pipe line.

Apparatus and methods for agricultural irrigation

An agricultural irrigation system comprised of a plurality of unit pipes which constitute a water supply pipe line and another plurality of unit pipes which constitute a water dispensing line each of whose respective pipe units are connected in series by one or more separate center, valve/connectors which couple successive pipe units of both the water supply pipe line and the water dispensing pipe line.

Growing community of inventors

Phoenix, AZ, United States of America

James Schlueter