Raytheon Company

Texas Instruments Corporation

Raytheon Technologies Corporation

Southern Methodist University

James S Wilson

James Stephen Mason

Karl L Worthen

Joshua Lamb

William P Hull, Jr

Michael A Moore

George F Barson

Trae M Blain

Alyson M Tuttle

Steven P McFarlane

James M Giesey

Robert S Isom

James M Irion, Ii

Travis L Mayberry

Donald C Price

Cary C Kyhl

Gordon R Scott

James M Elliott

Thomas H Taylor

Robert E Leoni

Timothy C Fletcher

Waid A Paine

Matthew D Brown

Ronald J Richardson

David E Swernofsky

Joseph Robson

Alex E Ockfen

Peter E Raad

Amanda S Rickman

Robert Arthur Condie

Jonathan Schmidt

Cory Thomas

James S Mason

Angel Crespo

Rafael Quintero

Adolfo Lozano, Iii

Erika Ramirez

Lucian A Braiser

A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.

Building liquid flow-through plates

An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.

Wire bonded air heat sink

A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

Coldplate with heat transfer module

A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.

RF waveguide housing including a metal-diamond composite-base having a waveguide opening formed therein covered by a slab

A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.

Ultrasonic additive manufacturing of cold plates with pre-formed fins

An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

Integrated electrical bus bars in liquid coldplate with high density interconnects

A multi-layer ceramic module is provided that includes an integrated temperature control and a power switch. The integrated temperature control is configured to dissipate thermal energy. The power switch is configured to couple a power source for a standard component of the multi-layer ceramic module to the integrated temperature control.

Integrated temperature control for multi-layer ceramics and method

An apparatus includes a heat sink configured to receive thermal energy from one or more heat sources. The heat sink includes a local reservoir configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.

Two-phase expendable cooling systems with passive flow control membranes

An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

Scalable thermal solution for high frequency panel array applications or other applications

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Vertical radio frequency module

In one embodiment, a hermetic covering system includes a projectile and at least one bag. The projectile has a body and a component that houses moisture-sensitive equipment. The at least one bag may be coupled to the body such that the projectile protrudes through the opening and the component is disposed in the inner cavity to protect the component during storage of the projectile.

Hermetic covering system and method for a projectile

A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

Multi-band electronically scanned array antenna

Aspects of embodiments according to the present invention are directed toward a circuitry and a method to accurately measure the junction temperature of power amplifier and uses the measurement to enable optimization of performance in the presence of a mismatched load via control of the power amplifier such that corrective action to mitigate effects of the mismatched load can be performed.

Performance optimization of power amplifier

Growing community of inventors

Hurst, TX, United States of America

James S Wilson