Intel Corporation

James S Webb

Michael L Rutigliano

Michael R Stark

Peter A Davison

Bill Lieska

Steve J Lofland

Daryl James Nelson

Scott L Noble

Michael T Zhang

Lloyd L Pollard, Ii

Nadir Sharaf

Don Weiss

Lawrence E McKay

Jack L Goodman

An apparatus and method for minimizing electromagnetic interference in a microcomputing system. The apparatus and method of the present invention are based on the fundamental aspect of providing an EMI shield specifically dimensioned to receive a microprocessor within the microcomputing system. The apparatus and method of the present invention are further based on the aspect of providing at least one ferrite bead along a power delivery path to attenuate any high-frequency leakage current from the microprocessor that results at the resonant frequencies of the EMI shield.

Apparatus and method for minimizing electromagnetic interference in microcomputing systems

An electronic cartridge which may include an integrated circuit package that is mounted to a substrate. The substrate may include a plurality of conductive pads that are inserted into an electrical connector. The cartridge may be guided into the connector by a guide rail which has a latch slot. The electronic cartridge may include a latch which extends from a cover that is coupled to the substrate. The latch may extend into the latch slot to secure the cartridge to the connector.

Mechanical latch for an electronic cartridge

A modular cooling apparatus for computer systems is disclosed. The apparatus includes an air-guiding duct, a fan coupling to the duct and a coupling apparatus for coupling the air-guiding duct and the fan to an electronics housing. The air-guiding duct has an input opening to the exterior of the electronics housing and guides ambient outside air to the input of the fan. Then the fan directs this outside air to the inside of the electronics housing. The electronic housing can be formed between a base module and the computer system circuit board or between the air-guiding duct, fan and a retention module. Furthermore, outside air is delivered in a substantially perpendicular direction relative to the plane of the computer system circuit board within the electronics housing.

Fan duct module

A retention system for an electronic cartridge which mates with connector that is mounted to a substrate. The system may include a first guide rail that is adapted to receive one edge of the electronic cartridge and a second guide rail that is adapted to receive another edge of the electronic cartridge. The guide rails may be mounted to the motherboard by a plurality of threaded fasteners and corresponding nuts. The guide rails guide the electronic cartridge into the connector. The system may further have a beam that extends from the first guide rail to the second guide rail. The guide rails and beam provide structural support for the electronic cartridge.

Keyed interlock and mechanical alignment integrated mechanical retention

An electronic cartridge. The cartridge may include a first cover and a second cover that are adjacent to a substrate. One or more integrated circuit packages may be mounted to the substrate. The cartridge may include a pin that extends from the first cover and which has a barb that is embedded into the second cover. The embedded barb will damage the second cover if the cover is removed from the cartridge. The present invention thus prevents the removal and re-installation of the cover from the cartridge.

Tamper resistant attach mechanism between plastic cover and thermal

An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.

Assembly for dissipatating heat from a semiconductor chip wherein a

An electronic cartridge that may include a cover which is attached to a thermal element. A substrate may be located between the thermal element and the cover. The cartridge may include a first pin which extends from the thermal element through a datum hole of the substrate. The cartridge may also have a second pin which extends from the thermal element through a first float hole of the substrate. The first float hole may have a major diameter and a minor diameter. The major diameter of the first float hole may be larger than the diameter of the second pin so that the second pin can move relative to the substrate. The first float hole allows movement of the second pin when there is a differential thermal expansion between the thermal element and the substrate.

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Portland, OR, United States of America

James S Webb