Texas Instruments Corporation

Nan Ya Technology Corporation

James S Wallace

Daniel A Baudouin

Ernest J Russell

Duy-Loan T Le

Ernie Russell

Peter Robert Linder

Alton D Carpenter

Jeffrey Johnson

A memory device is coupled to a subset of lines of a data input/output (I/O) bus. The memory device includes an on-die active termination circuit for terminating the subset of lines of the data I/O bus with a selected impedance being one of a plurality of selectable impedances; a termination value register being coupled to the on-die active termination circuit for storing a value representing the selected impedance; and a termination value setting circuit being coupled to the termination value register, for setting the value representing the selected impedance in the termination value register.

Signal termination scheme for high speed memory modules

Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperature a printed circuit board. The flat packages include leads (120, 121) which extend from an edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

Vertical package mounted on both sides of a printed circuit board

The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

High density semiconductor package

The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

A mounting device (170) of a semiconductor integrated circuit (202) allows edge mounting on surface of a printed circuit board (250). The mounting device includes a top portion (150) to provide for cooling and protection of the semiconductor chip while a side portion (140) provides for cooling and positioning on the printed circuit board.

High power dissipation vertical mounted package for surface mount

A packaged integrated circuit device (2) has exposed contacts (8a, 8b) for electrical connection to terminals of an electrical component, such as a bypass capacitor (10), mounted externally from packaging material (4). The contacts (8a, 8b) are electrically connected to power and ground leads (6) extending from packaging material (4).

Integrated circuit with supports for mounting an electrical component

An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads (14) electrically connected to the semiconductor die and lead frame supports (16, 18). A package (12) encapsulates the semiconductor die and a portion of the lead frame (15). The leads (14) extend from the package (12) and are bent to present a face for surface mount connection to conductors on a substrate. The supports (16, 18) extend from the package (12) for contacting the substrate to support the device (10) in position for soldering the leads (14) to conductors on the substrate.

Edge-mounted, surface-mount integrated circuit device

A memory card has a housing including an interior chamber and a top metal cover. A substrate is located in the interior chamber and carries printed circuit leads, packaged semiconductor devices connected to selected printed circuit leads, and a connector connected to selected printed circuit leads. The packaged semiconductor devices are spaced from the top metal cover and a thermal coupler is located between the top metal cover and the packaged semiconductor devices for coupling heat generated by the packaged semiconductor devices to the top metal cover.

Memory card with flexible conductor between substrate and metal cover

A split bonding pad provides a positive electrical indication of the proper electrical and mechanical connection of a capacitor to a printed circuit board by placing the electrical component terminal in series with electrical power supplied to a memory device while the electrical component remains in parallel connection with the memory device power lead. The proper mounting of the electrical component to the board becomes testable by testing continuity of a series circuit through the leads extending to the split bonding pad.

Growing community of inventors

Sugar Land, TX, United States of America

James S Wallace