International Business Machines Corporation

James Robert Wylder

Lester W Herron

David Clifford Long

Mark J LaPlante

Mark William Kapfhammer

William Dale Carbaugh, Jr

Nabil A Rizk

Jon Alfred Casey

Dinesh Gupta

John Ulrich Knickerbocker

James N Humenik

Thomas Edward Lombardi

David B Goland

Robert J Sullivan

Disclosed is a flex die punching apparatus for forming an aperture in at least one sheet of material. There is a flexible, extrudable platen which, upon exertion of a force against it, extrudes at least a portion of at least one sheet of material through an aperture of a die. The flexible, extrudable platen may have a punch feature, corresponding to the shape and position of the die aperture, which assists in the extruding of the flexible, extrudable platen through the die aperture and also in the formation of the aperture in the sheet of material. In another embodiment of the invention, there may be a second die wherein the at least one sheet of material is placed between the first and second dies to form the aperture in the sheet of material.

Flex die punching apparatus and method

Method for producing ceramic laminates from a plurality of greensheet layers which include one or more thin greensheet layers, e.g. having a thickness less than about 3 mils, with interposed patterned circuit layers and conductive vias, while avoiding the loss of strength and the distortion encountered when paste compositions are pre-applied to such thin greensheet layers. The invention avoids the aforementioned problems by the use of a plurality of greensheet layers including thicker, paste-resistant greensheet layers having a thickness greater than the thin greensheet layer, e.g., between 5 and 10 mils, each pair of the thicker greensheet layers confining therebetween an unscreened thin greensheet layer, one of the thicker greensheet layers also being screened with the circuit pattern layer normally applied to the interposed thin greensheet layer. Thereafter the superposed layers are laminated and sintered to form the composite.

Method for making ceramic substrates from thin and thick ceramic

Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.

Process for producing circuitized layers and multilayer ceramic

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Round Rock, TX, United States of America

James Robert Wylder