International Business Machines Corporation

James Robert Taylor

Danny Marvin Neal

John Saunders Corbin, Jr

Howard Victor Mahaney, Jr

Johnny Roy Brezina

Ciro Neal Ramirez

Walter Denton Scott

Roy A Rachui

Harville M Parks

Herbert E Meister, Jr

Fred Ervin Zumwalt

An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.

High density heatsink attachment and method therefor

A circuit board guidance device is arranged to have a circuit board such as a PCI I/O board 205 inserted therein for connection into an electrical socket or connector 203 located on a system motherboard 201. The guidance device includes a guidance mechanism which translates an insertion force applied in one direction into a connecting force effective to move the circuit board in a second direction. The guidance device is effective to aid in locating the circuit board 205 above connector 203 on the system motherboard 201, and also to aid in forcing the desired electrical connection between corresponding connectors on the circuit board 205 and a system motherboard 201. The guidance device is also effective in aiding in the extraction of the circuit board from its connection to the motherboard connector 203. An I/O bracket 261 is implemented to provide EMI grounding to the system bulkhead.

Locating and guidance device for printed circuit boards

A board-handling mechanism for more easily installing and removing boards from motherboards and/or other mountings within system enclosures such that it does not require the removal of the enclosure. The mechanism provides leverage to positively unseat circuit boards mounted into system connectors on the motherboard or other locations within system enclosures. A gripping mechanism is used for gripping one edge of the circuit board during the unseating process. The gripping mechanism is particularly adapted to provide additional force to unseat the circuit board. The gripping mechanism is adjustably mounted for accommodating circuit boards of various sizes.

Mechanism to assist in insertion or removal of PCI cards

A board-handling mechanism for more easily installing and removing boards from motherboards and/or other mountings within system enclosures does not require the removal of the enclosure. The mechanism provides leverage to positively seat and unseat circuit boards mounted into system connectors on the motherboard or other locations within system enclosures. A cable loop connector is provided within the enclosure opposite the opening for engaging the I/O connector on the forward edge of the daughterboard. The cable loop connector is biased to an upper position so that the daughterboard will first seat in the cable loop connector before being lowered and engaged to the motherboard connector.

Mechanism for inserting or removing I/O cards with internal connectors

An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.

Growing community of inventors

Leander, TX, United States of America

James Robert Taylor