International Business Machines Corporation

James Robert Rozen

Jerry M Chow

Mary Beth Rothwell

David William Abraham

George Andrew Keefe

Antonio D Corcoles Gonzalez

Jay Michael Gambetta

Roger Hilsen Koch

Frank Milliken, Jr

Matthias Steffen

Danielle DeGraw

Yat-Kiu-Kent Fung

Jason Scott Orcutt

Patryk Gumann

Salvatore Bernardo Olivadese

Martin O Sandberg

Hanhee Paik

Lev Samuel Bishop

Matthew J Farinelli

David P DiVincenzo

Guido Burkard

Inga Koch, Legal Representative

A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.

Electroplating of niobium titanium

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

Techniques for implementing multiple microwave attenuators on a high thermal conductivity substrate for cryogenic applications to reduce heat and thermal noise during quantum computing are provided. In one embodiment, a device for using in cryogenic environment is provided that comprises a substrate having a thermal conductivity above a defined threshold, a plurality of transmission lines fabricated on the substrate and arranged with a separation gap between the plurality of transmission lines to maintain crosstalk below &#x2212;50 decibels, and one or more microwave attenuators embedded on the plurality of transmission lines.

Cryogenic device with multiple transmission lines and microwave attenuators

A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.

Coaxial transmission line slot filter with absorptive matrix

A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.

Modular array of vertically integrated superconducting qubit devices for scalable quantum computing

Techniques relate to reading a qubit coupled to a microwave resonator. A microwave signal at a microwave resonator frequency is input to the microwave resonator that couples to the qubit. A microwave readout signal from the microwave resonator is output to a microwave to optical converter. The microwave readout signal includes a qubit state of the qubit. The microwave to optical converter is configured to convert the microwave readout signal to an optical signal. In response to the optical signal being output by the microwave to optical converter, it is determined that the qubit is in a predefined qubit state. In response to no optical signal being output by the microwave to optical converter, it is determined that the qubit is not in the predefined qubit state.

Read out of quantum states of microwave frequency qubits with optical frequency photons

A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.

Method of assembling microwave connector with filtering properties having outer and inner conductors

Method of forming a coaxial transmission line slot filter with absorptive matrix

A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.

Removal of spurious microwave modes via flip-chip crossover

Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossover

Growing community of inventors

Peekskill, NY, United States of America

James Robert Rozen