Sri International

Sarnoff Corporation

Ess Technology, Inc.

Pixel Vision, Inc.

James Robert Janesick

Maryn G Stapelbroek

Mark Muzilla

Eugene L Dines

A CMOS multi-pinned pixel having very low dark current and very high charge transfer performance over that of conventional CMOS pixels is disclosed. The CMOS pixel includes epitaxial silicon and at least one transfer gate formed upon the epitaxial silicon. A pinned-photodiode is formed in the epitaxial silicon. A multi-pinned (MP) implant layer is implanted in the epitaxial silicon at least partially extending across the pinned-photodiode and substantially underlying the at least one transfer gate of the CMOS pixel to promote dark current passivation during an accumulation state and promote charge transfer during a transfer state.

CMOS multi-pinned (MP) pixel

A readout transistor circuit for a pixel is disclosed. The readout transistor circuit includes a sense node. A reset transistor is in signal communication with the sense node. A source follower transistor is in signal communication with the sense node. A row select transistor is in signal communication with the source follower transistor. A switching transistor is in signal communication with the sense node. A capacitor is in signal communication with the switching transistor. The switching transistor is configured to place the capacitor in signal communication with the sense node to switch between a low voltage-per-charge (V/e&#x2212;) ratio and a high voltage-per-charge (V/e&#x2212;) to enable low noise performance of the sense node. The capacitor may be a metal-insulator-metal (MIM) capacitor. At least one of the reset transistor, the source follower transistor, the row select transistor, and the switching transistor may be a MOSFET. One or more of the MOSFETs may be a buried channel MOSFET.

Readout transistor circuits for CMOS imagers

A CMOS pixel is disclosed. The CMOS pixel includes a semiconductor substrate; a sense node formed in the semiconductor substrate and positioned substantially in the center of the CMOS pixel; a transfer gate formed about the sense node; and at least one photodiode formed about the transfer gate. A reset transistor, a source follower transistor, and a row select transistor are located substantially to one side of the CMOS pixel substantially adjacent to the photodiode. The sense node is operable to be floating. An implant may be formed about the photodiode configured to step potential in a direction toward the sense node.

Ring pixel for CMOS imagers

A method of manufacturing a CMOS image sensor is disclosed. A silicon-on-insulator substrate is provided, which includes providing a silicon-on-insulator substrate including a mechanical substrate, an insulator layer substantially overlying the mechanical substrate, and a seed layer substantially overlying the insulator layer. A semiconductor substrate is epitaxially grown substantially overlying the seed layer. The mechanical substrate and at least a portion of the insulator layer are removed. An ultrathin oxide later is formed substantially underlying the semiconductor substrate. A mono layer of metal is formed substantially underlying the ultrathin oxide layer.

SOI-based CMOS imagers employing flash gate/chemisorption processing

A CMOS image sensor is disclosed. The CMOS imager includes a lightly doped semiconductor substrate of a first conductivity type. At least one CMOS pixel of a second conductivity type is formed in the semiconductor substrate. The semiconductor substrate is configured to receive a bias voltage applied for substantially depleting the semiconductor substrate and for forming a depletion edge within the semiconductor substrate. A well of the second conductivity type substantially surrounds the at least one CMOS pixel to form a depletion region about the at least one CMOS pixel operable to form a minimum predetermined barrier to the depletion edge within the semiconductor substrate to pinch off substrate bias in proximity to the return contact.

Substrate bias for CMOS imagers

A method of manufacturing a CMOS image sensor is disclosed. A silicon-on-insulator substrate is provided, which includes providing a silicon-on-insulator substrate including a mechanical substrate, an insulator layer substantially overlying the mechanical substrate, and a seed layer substantially overlying the insulator layer. A semiconductor substrate is epitaxially grown substantially overlying the seed layer. The mechanical substrate and at least a portion of the insulator layer are removed. An ultrathin oxide layer is formed substantially underlying the semiconductor substrate. A mono layer of metal is formed substantially underlying the ultrathin oxide layer.

An imager, an image sensor included in the imager and a method of fabricating the image sensor are provided. The image sensor having a substrate with front and back sides to produce image data, includes a transparent conductive coating arranged on the back side of the substrate, a first well region of a first conductive type having first and second opposite sides, the first side being arranged adjacent with the front side of the image sensor; and a second well region of a second conductive type, different from the first conductive type and having a deep well region provided adjacent with the second side of the first well region, the transparent conductive coating configured to develop or to receive a first potential and the first well region configured to receive a second potential to substantially deplete a region between the transparent conductive coating and the first well region.

Image sensor with deep well region and method of fabricating the image sensor

An imager includes an array of imager cells coupled to a multi-mode controller. The multi-mode controller includes circuitry that implements several modes of operation, including a high-light mode, a low-light mode, and a Snap mode. The high-light mode provides charge accumulation in a photoreceptor potential well, a readout potential well, and a sense node potential well. The low-light mode provides charge accumulation in the photoreceptor potential well constrained by an integration potential well. The Snap mode of operation simultaneously transfers accumulated charge for a set of the imager cells to their sense nodes. In addition, the multi-mode controller may select one of a plurality of V+ integration voltages for setting up a selected charge capacity in one of the imager cells. Thus, the V+ integration voltage may be increased to provide charge capacity to address increased light levels. The imager thereby provides low noise characteristics and is configurable for a wide range of charge capacity, for a wide range of light levels, as compared to conventional imager cell implementations.

Multi-mode imager with pinned photo region photoreceptors

An imager includes an array of imager cells coupled to a multi-mode controller. The multi-mode controller includes circuitry that implements several modes of operation, including a high-light mode, a low-light mode, and a Snap mode. The high-light mode provides charge accumulation in a photoreceptor potential well, a readout potential well, and a sense node potential well. The low-light mode provides charge accumulation in the photoreceptor potential well constrained by an integration potential well. The Snap mode of operation simultaneously transfers accumulated charge for a set of the imager cells to their sense nodes. In addition, the multi-mode controller may select one of a plurality of V&plus; integration voltages for setting up a selected charge capacity in one of the imager cells. Thus, the V&plus; integration voltage may be increased to provide charge capacity to address increased light levels. The imager thereby provides low noise characteristics and is configurable for a wide range of charge capacity, for a wide range of light levels, as compared to conventional imager cell implementations.

A back thinned CCD has at least first and second parallel n&minus; signal channel segments and a p&plus;&plus; channel stop region between the signal channels.

Back side thinned CCD with high speed channel stop

An optical detector includes a charge-coupled device (CCD). The CCD comprises an active cell for receiving a narrow beam of incident illumination and generating photoelectrons in response thereto, and a first stage readout register comprising a row of N transfer cells, where N&gt;1. A first stage gate structure transfers charge packets consecutively from the active cell into the first stage readout register, whereby N successive charge packets are read into the N cells respectively of the first stage readout register. N second stage readout registers each comprise M transfer cells, where M&gt;1, and a second stage gate structure transfers N charge packets from the N cells of the first stage readout register into respective first cells of the second stage readout registers and subsequently shifts the N charge packets from the respective first cells of the second stage readout registers to respective Mth cells thereof. A multiplexer has N inputs coupled respectively to the Mth cells of the second stage readout registers. The multiplexer is operative to connect a selected input to its output. The multiplexer provides an output signal that varies in accordance with variation in intensity of incident illumination on the active cell.

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Huntington Beach, CA, United States of America

James Robert Janesick