Ge Lighting Solutions LLC

Lumination LLC

Consumer Lighting (u.s.), LLC

James Reginelli

Emil Vergilov Radkov

Srinath K Aanegola

Matthew S Mrakovich

Tomislav Josip Stimac

Larry R Stadelman

Gary Robert Allen

Stanton Earl Weaver, Jr

Joshua Ian Rintamaki

Dengke Cai

Thomas Frederick Soules

Glenn Howard Kuenzler

Thomas Clynne

Zhiyong Wang

David C Dudik

Jianmin He

Boris Kolodin

Cherian Jacob

Charles L Huddleston, Ii

The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module, configured to generate a visible light such as white light, and at least one component such as optical component comprising a compound consisting essentially of the elements neodymium (Nd) and fluorine (F), and optionally including one or more other elements. The lighting apparatus is configured to provide a desired light spectrum by filtering the generated visible light using the compound.

LED apparatus employing neodymium-fluorine materials

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Light emitting diode component

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.

Light emitting diode (LED)-based light bulb

In a light emitting package (), at least one light emitting chip () is supported by a board (). A light transmissive encapsulant () is disposed over the at least one light emitting chip and over a footprint area () of the board. A light transmissive generally conformal shell () is disposed over the encapsulant and has an inner surface () spaced apart by an air gap (G) from, and generally conformal with, an outer surface () of the encapsulant. At least one phosphor () is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell () is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m&#xb7;K).

Light emitting packages and methods of making same

A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

Circuit board for direct flip chip attachment

A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.

Incorporating reflective layers into LED systems and/or components

Growing community of inventors

Parma, OH, United States of America

James Reginelli