North American Specialties Corporation

Teka Interconnections Systems, Inc.

Interplex Nas, Inc.

Teka Interconnection Systems

James R Zanolli

Joseph S Cachina

Jack Seidler

A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.

Solder-bearing articles and method of retaining a solder mass along a side edge thereof

A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.

Solder wire construction

An electrical connector for electrically connecting a first electronic device to a second electronic device includes a housing that includes a plurality of solder retention channels that hold a plurality of solder segments in a vertical orientation such that at least a vertical surface and one end of each solder segment are exposed. The solder retention channels are formed in first and second opposing rows with an open space formed therebetween. The exposed vertical surfaces of the solder segments face one another.

Electrical connector with solder retention means for assembly

According to one embodiment, an electrical connector for electrical connection to a second electronic device having at least one second contact includes a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface. The connect also has a first contact securely coupled to the substrate and having a first portion extending at least partially into the recess and a mass of solder material retainingly held in the recess such that the first portion of the first contact is in contact with the solder material. The first surface is for placement against the second electronic device such that the first and second contacts are aligned and whereupon heating of the mass of solder material, the first and second contacts are securely attached to one another and form an electrical pathway therebetween.

Solder-bearing wafer for use in soldering operations

In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

Solder-bearing contacts and method of manufacture thereof and use in connectors

A solder-bearing wafer is provided for use in a soldering operation. The solder-bearing wafer is designed to provide a solder material which is used in a soldering operation for electrically connecting a first electronic device to a second electronic device. According to a first embodiment, the wafer comprises a substrate body having a first surface and an opposing second surface. The first surface has at least one groove formed therein and the wafer also includes at least one length of solder material securely disposed within the at least one groove. Upon heating of the at least length of solder material and placement of the substrate body between the first and second electronic devices, at least one first contact of the first electronic device is securely and electrically connected to at least one second contact of the second electronic device. The first and second electronic devices may be of a through hole type, surface mount type, or ball grid array type.

A solder bearing&#x2014;bearing wafer () is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and second surface, opposing the first surface. The first surface has grooves () formed therein and includes length of solder () dispersed within groove. Upon heating the solder and placement of the wafer between the first and second devices, the two devices are connected.

The present invention provides a method of forming a solder ball on a portion, e.g., one end, of a contact. In one exemplary embodiment, the contact is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. Generally and according to one embodiment, the method includes providing the contact along with a solder-holding clip having a body with an opening. The body has a solder-holding conformation adjacent the opening and a solder mass is held by the conformation. The contact is then positioned proximate to the body opening and heat is applied to the solder mass causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball being formed on the portion of the contact. Subsequent to forming the solder ball, the solder-holding clip is separated from the contact leaving a contact with a solder ball affixed thereto. Preferably, a series of solder-holding clips are provided along a carrier strip of material so that a number of solder balls may be formed on corresponding contacts during a single reflow operation.

Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector

An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Solder-holding clips for applying solder to connectors or the like

A press fit contact for through hole mounting has a longitudinal axis and a contact portion along the axis for mounting with an associated electrical component to make electrical contact therewith. A leg portion is configured and dimensioned to be inserted through a mounting plated through hole of a support member. The leg portion includes an interference element along at least a portion thereof dimensioned to be receivable within the plated through hole to establish a press-fit or interference-fit and mechanical and electrical contact with the plating on the mounting hole. An intermediate portion is provided between and integrally formed with the contact and leg portions, the portions all being generally aligned along the longitudinal axis. A pressure-bearing, in each instance element, in the form of one or more holes and with or without associated blade tabs, is formed on the intermediate portion within the perimeter or inside the lateral edges defined by the intermediate portion. A pressure member element in the form of a molded plastic member is arranged on the intermediate portion to encapsulate the pressure-bearing, in each instance element or elements to transmit forces applied thereto acting along the longitudinal axis in the direction from the contact portion towards the leg portion. In this manner, insertion forces applied to the pressure-applying member are transmitting to the intermediate and leg portions for facilitating insertion of the leg portion through the plated through hole by coupling the forces to the pressure bearing elements or elements.

Growing community of inventors

North Smithfield, RI, United States of America

James R Zanolli