Hemlock Semiconductor Corporation

Dow Corning Corporation

James R McCormick

Arvid Neil Arvidson

Lydia L Hwang

Michael Bourbina

Scott Allen Wheelock

Michael H Greene

The present invention is a float-zone process for forming particulate silicon into monocrystalline silicon. The process employs a reusable silicon conduit having a lower end heated to form a melt zone and an upper end provided with a means for delivering a controlled amount of particulate silicon to the melt zone. A monocrystal silicon seed is used to pull a monocrystalline silicon ingot from the melt zone and particulate silicon is added to the melt zone to replenish silicon removed as monocrystalline silicon.

Float zone processing of particulate silicon

A method for analyzing and quantifying the individual trace metals content of a semiconductor material in the low to sub-parts per billion (ppba) range. The method comprises (A) float-zone refining of a sample of the semiconductor material creating a melt zone containing essentially all the trace metals of the sample; (B) cooling the melt zone to form a solid zone concentrated in trace metals; (C) separating the solid zone concentrated in trace metals from the sample of the semiconductor material; (D) converting the solid zone concentrated in trace metals into a form suitable for trace metals analysis; (E) analyzing the solid zone with known trace metals analytical techniques; and (F) calculating total trace metals from these analytical results. This method can also be applied to the small tip which forms on the side of the solid zone.

Trace metals analysis in semiconductor material

An improvement in a process for the production of semiconductor materials from the vapor decomposition of a precursor compound of the desired semiconductor material and the deposition of the desired semiconductor material. The improvement comprises the heating of the exterior surface of a metallic enclosure of a reactor to facilitate preheating thin rods of the semiconductor material, the rods supplying the heat for decomposition and acting as a substrate for deposition, to a temperature of about 250.degree. C. to render the thin rods conductive enough to effectively pass an electric current.

Growing community of inventors

Midland, MI, United States of America

James R McCormick