USA As Represented by Secretary of the Navy

Geo-centers, Inc.

James R Griffith

Jacques G O'Rear

Teddy M Keller

Henry S Hu

Arthur W Snow

Leonard J Buckley

Donald E Field

Mark Ray

Meyer R Achter

Liliana Klinger

Stephen L Snyder

A composition comprises a leachable organic compound distributed throughout a polymer matrix formed by reacting a fluoroepoxy compound of the formula: ##STR1## wherein x is an integer from 0 to 12, with a silicone amine curing agent of the formula: ##STR2## where n is the average degree of polymerization of the silicone amine curing agent and is 1 or greater. The leaching rate of the leachable organic compound is controlled by selecting the value of x in the fluoroepoxy compound and the value of n in the silicone amine curing agent. The composition may be used as a coating for protecting underwater substrates from fouling by marine organisms.

Silicone-containing fluoropolymers for controlled release of organic

A metallization is coated with a network polymer. The network polymer may either a cross-linked polyfluorinated polyallylether-polyhydromethylsiloxane copolymer or a network polymer formed from cross-linked fluoromethylene cyanate ester monomers. These polymer networks are resistant to the diffusion of a metallization, such as copper, therethrough.

Inter-level dielectrics with low dielectric constants

A reaction product of a liquid monomeric allyletherfluoroalkylene benzene d a liquid polymethylhydrosiloxane, which reaction product in a cured, solid state has dielectric constant below about 2.5.

Low dielectric constant allylics

A metallization is coated with a network polymer. The network polymer may be either a cross-linked polyfluorinated polyallylether-polyhydromethylsiloxane copolymer or a network polymer formed from cross-linked fluoromethylene cyanate ester monomers. These polymer networks are resistant to the diffusion of a metallization, such as copper, therethrough.

A nontoxic antifouling system is provided at ambient conditions on a subste which has a solid release layer bonded to a solid bonding layer which in turn is bonded to said substrate. The release layer has excellent release property and is bonded to the bonding layer. The bonding layer contains a component which is believed to react with the same or a similar component in the release layer to enhance the desired bond therebetween. The bonding layer is tougher than the release layer but its release property is inferior to that of the release layer.

Nontoxic antifouling systems

A highly fluorinated benzene compound is reacted with acryloyl chloride to ield a fluorinated liquid product which is used to impregnate a reinforcing structure. Upon impregnation, the liquid material is polymerized at about 55.degree. C. to produce a reinforced polymeric structure, which can be a circuit board. The polymer has dielectric constant of about 2.1, which is very low compared to the polymers used presently.

Fluorinated resins with low dielectric constant

An infinite network polymer containing fluorine as a coating or cladding material for optical fibers. Fluoropolymers, such as silicone amine C.sub.0 -C.sub.16 fluoroepoxy resin and cis-trans fluoropolyol polyacrylate, reduce water permeability because of the bonding between the fluoropolymer and the substrate. The fluoropolymers exhibit substantially increased moisture resistance when compared to conventional fiber coating materials. Variations in chemical structure effect physical properties of the polymer and different compounds can be chosen for their desired physical properties, such as moisture resistance or abrasion resistance. Incorporation of fluorine into the polymer structure lowers the index of refraction such that the polymer can be used as a cladding for silica glass in an optical fiber. One fluoropolymer formulation allows in-line coating of the optical fiber in a oxygen environment.

Epoxy-functional fluoropolyol polyacrylate coating of optical fibers

A highly fluorinated benzene compound is reacted with acryloyl chloride to ield a fluorinated liquid product which is used to impregnate a reinforcing structure. Upon impregnation, the liquid material is polymerized at about 55.degree.C. to produce a reinforced polymeric structure, which can be a circuit board. The polymer has dielectric constant of about 2.1, which is very low compared to the polymers used presently.

Fluoroepoxy resins for use in computer composite circuit boards. A 'glass state' curing agent containing a fluorinated monoanhydride, a fluorinated dianhydride and a catalyst is compounded at a temperature of about 210.degree. C. The curing agent is blended with di- and tri-functional epoxy resins at 100.degree. C. or higher to give homogeneous fast-curing syrups. Fluoroepoxy resins inherently have low dielectric constants. This method produces a fluoroepoxy resin with higher crosslink densities and higher glass transition temperatures.

Fluorinated epoxy resins with high glass transition temperatures

A fluoroacrylate ester monomer having the formula: ##STR1## wherein R.sub.1 and R.sub.2 are independently selected from the group consisting of saturated aliphatic hydrocarbons having from 1 to about 3 carbon atoms and R.sub.3 is selected from the group consisting of hydrogen and methyl. The monomer has a water-repellent 'umbrella' of 3 gem bis trifluoromethyl groups around the acrylate monomer which do not interfere with the acrylate properties. Polymerization of the monomer results in a stable, exceptionally hydrophobic, linear thermoplastic polymer. The invention also includes processes for making the monomer from a diether halide and certain novel intermediates.

Fluoroacrylate ester, polymer thereof, and process of making the same

A diacrylate monomer represented by the formula: ##STR1## wherein R represent CF.sub.3 or C.sub.2 F.sub.5, R' represents --H or --sub.3, R' represents H or --(CF.sub.2).sub.n F, and n is an integer from 1 to 10, and polymer therefrom.

Fluorinated diacrylic esters

Fluorinated diacrylic esters and polymers therefrom

Iodophthalonitrile is prepared by mixing aminophthalonitrile with sulfuric acid at a temperature below 25.degree. C., reacting that product with sodium nitrite at a temperature below 15.degree. C., and reacting that product with potassium iodide at a temperature below 20.degree. C. A fluoroalkyl phthalonitrile is prepared by mixing fluoroalkyl iodide, activated copper, iodophthalonitrile, and a solvent under an inert atmosphere at a temperature from 110.degree. C. to 125.degree. C. at least until the solution turns green. Both compounds are useful in synthesizing phthalocyanines and polyphthalocyanines.

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Riverdale Heights, MD, United States of America

James R Griffith