Shell Oil Comapny

Scm Corporation

Kraton Polymers U.S. LLC

James R Erickson

David J St Clair

Robert Charles Bening

Michael A Masse

Steven H Dillman

David Romme Hansen

Carma J Gibler

Joe J Flores

Dale Lee Handlin, Jr

Kirk J Abbey

Charles J Stark

Esther M Zimmermann

Paul A Mancinelli

Carl Lesley Willis

Kailash C Dangayach

Robert J Sutherland

Robert Joseph Seidewand

Robert Q Kluttz

Vincent D McGinniss

William H Korcz

Craig A Stevens

David Ralph Stewart

James H Collins

Lee Nicky Morgenthaler

Michael Alan Masse

Kathleen Suzanne Kiibler

Cary Alan Veith

Earle E Ewins, Jr

David Lee Shafer

Dennis W Gilmore

Larry McArthur Kegley

Barbara L Kunz

John L Greak

Michael J Watkins

Jeffrey George Southwick

James Crivello

Bhaskar P Rao

UV curable adhesives are provided that comprise epoxidized monohydroxylated polydiene polymers, hydrogenated hydroxylated polydiene polymers, and selectively hydrogenated starblock copolymers. The adhesive formulations provide both excellent room temperature properties of tack and peel and excellent holding power at temperatures as high as 95&#xb0; C.

UV curable pressure sensitive adhesives

This invention is a process for making UV curable adhesives, sealants, coatings, ink, flexible printing plates, laminating adhesives, fibers, gaskets, and related compositions, films, and thin parts, wherein an epoxidized monohydroxylated polydiene polymer comprised of at least two different diene monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation is used as the binder for the composition. The preferred epoxidized monohydroxylated polymers are block copolymers of isoprene and butadiene wherein a hydroxyl group is attached at one end of the polymer molecule. These polymers may be hydrogenated or unhydrogenated. The process involves mixing the above polymer or the polymer with one or more other formulating ingredients together with and insoluble photoinitiator which is preferably selected from the group consisting of triaryl sulfonium salts. The mixture is then subjected to mixing conditions in a high speed mixer, preferably a high speed disk disperser, at a blade tip speed of from 200 to 2000 cm/sec at a temperature from 25 to 130&#xb0; C., preferably from 40 to 100&#xb0; C. This process is highly suited for making stable cationic photoinitiator concentrations that can be added to adhesive, coating, or sealant formulations to effect rapid UV cure.

Non-aqueous solvent-free process for making UV curable adhesive and sealants from expodized monohydroxylated diene polymers

Formulation for strippable adhesive and coating films and high performance adhesive

Monohydroxylated diene polymers and epoxidized derivatives thereof

A crosslinkable waterborne dispersion of an epoxidized polydiene block polymer composition which comprises: (a) 10 to 65% w of a polydiene block polymer containing at least five olefinic epoxy groups per molecule which are sterically hindered, (b) 0.2 to 25% w of a compatible aminoplast, (c) 0.1 to 10% w of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. The invention also describes a water-continuous process and an inversion processes for making such dispersions.

Crosslinkable waterborne dispersions of epoxidized polydiene block copolymers and amino resins

A crosslinkble waterborne dispersion useful as a coating on metal substrates of an epoxidized polydiene block polymer composition which comprises: (a) 10 to 65% by weight of a polydiene block polymer containing at least five olefinic epoxy groups per molecule which are sterically hindered, (b) 0.2 to 25% by weight of a compatible aminoplast, (c) 0.1 to 10% by weight of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. A water-continuous process and an inversion process for making a dispersion are also described.

Waterborne dispersions of epoxidized polydiene block copolymers and amino resins

It has been surprisingly found that certain properties including adhesion strength to smooth surfaces may be improved by making hot melt adhesives from blends comprising a poly-1-butene polymer, a tackifier resin, and from 3 wt. % to 25 wt. % of a liquid or semi-liquid, hydrogenated or partially hydrogenated low molecular weight conjugated diene polymer prepared by anionic polymerization. Any one of the following three polymers can be used in the adhesive formulation of this invention: 1) a hydrogenated styrene isoprene diblock copolymer having a number average molecular weight from 4000 to 30,000, preferably 6000 to 15,000, a polystyrene content of 5 to 15 percent by weight, preferably 8 to 12 percent by weight, which is at least 75 percent hydrogenated, preferably at least 85 percent hydrogenated; or 2) a hydrogenated polydiene polymer which may have one diene block of either isoprene or butadiene or maybe a diblock polymer wherein one block is of isoprene and the other block is of butadiene, and wherein the polymer may have a terminal hydroxy group, and wherein the polymer has a number average molecular weight of 500 to 20,000, preferably 1000 to 10,000, and is at least 75 percent hydrogenated, preferably at least 85 percent hydrogenated; or 3) a polyisoprene homopolymer having a number average molecular weight of 15,000 to 40,000, preferably 20,000 to 30,000 which is at least 75 percent hydrogenated, preferably at least 85 percent hydrogenated.

Polybutene/liquid polydiene hot melt adhesive

A pressure structural or sealant composition comprises (a) from 15 to 95% by weight of a telechelic polymer such as a glycidyl ether-functional telechelic polymer and from 5 to 85% by weight of a heterotelechelic polydiene block polymer wherein at least one of the functonalities is the same as the functionality of the telechelic polymer, such as a heterotelechelic polydiene block polymer with glycidyl ether and another functionality such as olefinic unsaturation or epoxidized olefin; and (b) a dual curing system wherein one curing agent cures the teolechelic polymer and the common functionality on the heterotelechelic polydiene block polymer such as an aliphatic polyamine, and the other curing agent cures the other functionality on the heterotelechelic polydiene block polymer but does not cure under conditions required to cure the telechelic polymer, such as a sulfur-based curing agent when the functionality is olefinic unsaturation or an amino resin when the functionality is epoxidized olefin.

Telechelic polymers and heterotelechelic polydiene block polymers with

Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.

Adhesives and sealants based on telechelic polymers and heterotelechelic

A pressure sensitive structural or sealant composition comprises (a) from 15 to 95% by weight of a telechelic polymer such as a hydroxyl-functional telechelic polymer and from 5 to 85% by weight of a heterotelechelic polydiene block polymer wherein at least one of the functionalities is the same as the functionality of the telechelic polymer, such as a heterotelechelic polydiene block polymer with hydroxyl and glycidyl ether funciontialities, and (b) a dual curing system wherein one curing agent cures the teolechelic polymer and the common functionality on the heterotelechelic polydiene block polymer such as a polyisocyanate, and the other curing agent cures the other functionality on the heterotelechelic polydiene block polymer at higher temperatures but does not cure under conditions required to cure the telechelic polymer, such as a polycarboxylic acid, polycarboxylic acid anhydride or a catalyst.

A pressure sensitive structural adhesive or sealant composition comprises a) a polymer system containing from 95 to 15 percent by weight of a telechelic polymer such as a polyhydroxylated diene block polymer and from 5 to 85 percent by weight of a heterotelechelic polymer such as an epoxidized monohydroxylated diene block polymer, and b) a dual curing system wherein one element such as a polyisocyanate cures the telechelic polymer at ambient temperature, and the other element such as an amino resin cures the heterotelechelic polymer.

Telechelic and heterotelechelic polymers with dual curing agents

In a process of curing epoxidized polymers of conjugated dienes which contain aromatic moieties by exposing the polymers to ultraviolet radiation in the presence of a photoinitiator, the improvement which comprises reducing the amount of irradiation necessary to achieve an effective cure by adding a small but effective amount of a photosensitizer which absorbs UV radiation in a wavelength range which is not obscured by the polymer to the polymer prior to or during irradiation.

Process for radiation cured conjugated diene-vinyl aromatic hydrocarbon

A crosslinkable waterborne dispersion of a hydroxy functional polydiene polymer composition which comprises: (a) 10 to 65% w of a hydroxy functional polydiene polymer, (b) 0.2 to 25% w of a compatible amino resin, (c) 0.1 to 10% w of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. The invention also describes a water-continuous process and an inversion processes for making such dispersions.

Crosslinkable waterborne dispersions of hydroxy functional polydiene

The invention herein is curable adhesive and sealant compositions and a non-aqueous solvent free process for producing such compositions which comprise a mono-ol, tackifying resin, and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethylenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves mixing the components together with a photoinitiator which is selected from the group consisting of diaryl, especially diaryliodonium, salts characterized by the general formula: ##STR1## where Y is ##STR2## where R is hydrogen, aryl, alkyl, or an alkylhalide; n is an integer of at least 1, Z is I, Cl, or Br, preferably I, and X is a complex metal halide anion or a complex halide anion of a strong protonic acid.

Non-aqueous solvent free process for making UV curable adhesives and

Growing community of inventors

Katy, TX, United States of America

James R Erickson