E.i. Dupont De Nemours and Company

Du Pont Toray Company Limited

James R Edman

Meredith L Dunbar

Charles M Paulson, Jr

Donald J Coulman

Akimitsu Tsukuda

Masakazu Okahashi

Tsuneyoshi Miwa

Kenji Uhara

Hideki Moriyama

Meredith Lynn White

The substrates of the present invention comprise a polyimide base polymer derived at least in part from non-rigid rod monomers together with optionally rigid rod monomers where the substrates are cured under low tension. The resulting polyimide materials have been found to provide advantageous properties (e.g. balanced molecular orientation, good dimensional stability, and flatness) particularly useful for electronics type applications.

Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto

A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10  N/cm, and more preferably greater than 19 N/cm.

Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto

A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.

Polyimide composition having improved peel strength when clad

A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.

Process for preparing a metallized polymide film containing a

Metallized polyimide film containing a hydrocarbyl tin compound

An isotropic, biaxially stretched polyimide film prepared by casting a solution of a polyamic acid precursor in an organic solvent containing a cyclization catalyst and dehydrating agent onto the surface of a support, imidizing the polyamic acid to give a continuous self-supporting gel film containing 5-50% by weight of solids, stretching the gel film in the machine direction (MD) at a ratio of 1.1-1.9, and stretching in the transverse direction (TD) with respect to the machine direction so as to maintain a TD/MD stretch ratio of from 0.9 to 1.3.

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Circleville, OH, United States of America

James R Edman