Other

Lam Research Corporation

Disney Enterprises, Inc.

Analogic Corporation

Woodward Governor Company

James R Bowers

Helen H Zhu

Dirk Edward Van Dall

Keith Comito

Michael Goss

Anthony Waters

Thomas Engel

S M Reza Sadjadi

John M Dobbs

Ruvin Deych

David R Pirkle

Ian J Morey

Siyi Li

Robert C Hefty

Mark Todhunter Robson

Si Yi Li

Daniel C Garvey

Michael Victor

Audrey Charles

Bruce G Bailey

Wayne Babie

Pizza cutter

According to one implementation, a method of guiding an interaction between a companion module and a user includes identifying a media content for playout by a media player device, transmitting, to a remote server, an interaction schema request identifying the media content and the companion module, and receiving, from the remote server, behavioral manifest data including an instruction for guiding the interaction between the companion module and the user. Such a method also includes obtaining a play head state of the media player device and a playout timecode state of the media content, and identifying a user interaction behavior for the companion module based on the behavioral manifest data, the play head state of the media player device, and the playout timecode state of the media content.

Guided interaction between a companion device and a user

A method etching features through a stack of a silicon nitride layer over a silicon layer over a silicon oxide layer in a plasma processing chamber is provided. The silicon nitride layer is etched in the plasma processing chamber, comprising; flowing a silicon nitride etch gas; forming the silicon nitride etch gas into a plasma to etch the silicon nitride layer, and stopping the flow of the silicon nitride etch gas. The silicon layer is, comprising flowing a silicon etch gas, wherein the silicon etch gas comprises SFor SiF, forming the silicon etch gas into a, and stopping the flow of the silicon etch gas. The silicon oxide layer is etched in the plasma processing chamber, comprising flowing a silicon oxide etch gas, forming the silicon oxide etch gas into a plasma, and stopping the flow of the silicon oxide etch gas.

Silicon on insulator etch

A tube mounting assembly for total traverse or static traverse sensing tubes is provided for use with Pitot tube devices where the tubes are allowed to expand and contract independent of the flow element shell. A female threaded pipe cap is tack welded or otherwise affixed to the inside internal surface of the flow element shell. A &#xbd; inch NPTX tube fitting of the bore-thru fitting type is affixed to the pipe cap, and a traverse tube, sealed by high temperature packing or thread sealant between the tube and a tube nut, are then affixed to the opposite end of the bore-thru tube fitting.

Internal tube support for flow elements providing for tube expansion within the flow element shell

An improved manual purge system for periodically cleaning pressure sensing flow element tubing is provided that is a complete self-contained system for allowing manual determination and initiation of flow element purging. Additionally, the system can be easily upgraded to an automatic purge system without removal from the process system.

Manual purge system for instrumentation flow element tubing

Method for etching a feature in an integrated circuit wafer with minimized effect of micromasking. The method introduces a flow of etchant gas including a fluorocarbon gas to the wafer, and uses the etchant gas to form a plasma in proximity with at least a portion of the wafer. The plasma is used to etch at least a portion of the feature in the wafer. Disassociation of the fluorocarbon into fluorine and hydrocarbon species performs two functions. The fluorine species prevents or significantly reduces sputtered hardmask components from depositing on the floor of the etched feature during etching. The hydrocarbon species acts to form a passivation layer on the sidewalls of the feature.

Unique process chemistry for etching organic low-k materials

An automated condensate drain system for gas flow elements is provided that includes a differential pressure transmitter, a sequence controller, and two condensate chambers for receiving and collecting accumulated moisture from air flow elements and transmitters. The condensate chambers are placed in low profile positions within the instrument piping system, requiring downward sloping of the instrument tubing to accentuate condensation drainage. The sequence controller initiates a drainage cycle (set as desired by operator), permitting the transmitter to enter an auto-zero cycle, thereby energizing an internal isolation valve in the transmitter while maintaining the transmitter output. The sequence controller energizes solenoid valves of the two condensate chambers, wherein the chambers open to permit drainage of accumulated moisture assisted by static pressure system. After the drainage cycle is completed, the sequence controller de-energizes solenoid valves and returns the drain valves to a closed position and the transmitter returns to normal operation.

Automated condensation drain system

The invention provides a process for plasma etching silicon carbide with selectivity to an overlapping and/or underlying dielectric layer of material. The etching gas includes a hydrogen-containing fluorocarbon gas such as CH F, an oxygen-containing gas such as O and an optional carrier gas such as Ar. The dielectric material can comprise silicon dioxide, silicon nitride, silicon oxynitride or various low-k dielectric materials including organic low-k materials. In order to achieve a desired selectivity to such dielectric materials, the plasma etch gas chemistry is selected to achieve a desired etch rate of the silicon carbide while etching the dielectric material at a slower rate. The process can be used to selectively etch a hydrogenated silicon carbide etch stop layer or silicon carbide substrates.

Method of plasma etching of silicon carbide

A high temperature gas flow sensing element module, using Pitot tube technology, for use within a fluid conduit consisting of a housing having an inlet, an outlet, and forming a hollow interior cross-sectional area. Individually, the gas flow sensing element modules fit easily through typical furnace access doors. Thus, in typical furnace retrofit applications, a plurality of equally sized gas flow sensing element modules are arranged adjacent one another in a manner such that the inside dimensions of the entire arrangement coincide with the internal dimensions of the plenum or duct opening into which it is inserted. Pressure averaging piping is used to provide average total and static pressure across the entire gas flow sensing element to differential pressure flow indicators and/or transmitting devices.

Modular high-temperature gas flow sensing element for use with a cyclone furnace air flow measuring system

A tube packing extension assembly is provided, wherein a conventional cap fitting with plug fitting is replaced with a tube packing extension enclosure that incorporates an extended, linearly elongated outer tube sheath for circumscribing in a concentric manner any tube end that extends outward from the outer conduit sidewall. This outer tube sheath is formed as attached to a tube fitting connection nut, and provides an extension, of selectable size, that extends outward from the conduit sidewall, yet fully encloses and protects the end of the sensing tube. A tube packing extension cap can thereby be removably affixed to the outer end of the tube packing extension enclosure outward by a sufficient length should any brushing or purging of the tubes be required.

Tube packing extension assembly for use in high temperature gas flow sensing elements and the like

Disclosed is a high temperature insertion type flow element and mounting extension assembly for a gas flow measuring device. Designed to overcome the drawbacks associated with compensating for differential thermal expansion between the element and the duct wall, the element consists of an otherwise conventional insertion type flow element, that incorporates the use of a mounting extension assembly and an expansion fitting. The mounting extension positions the element head in an offset manner from the gas duct, placing the element head in a position away from any insulating materials encasing the duct, allowing for convenient access to the instrumentation and cleaning ports. The expansion fitting stabilizes the element tubes within the duct while absorbing any differential thermal expansion.

High temperature insertion type flow element and mounting extension

A computed tomography system having a fourfold improvement in both short-and long-term beam position stability. A beam-position detector is located at a peripheral edge of the primary fan beam and is fixed relative to the primary detectors so as to indicate beam position on the primary detectors. The beam-position detector is oriented so that its maximum sensitivity to beam motion is in the direction of beam movement due to focal spot drift due to thermal effects and gravity. Short-term focal spot drift is detected by a secondary beam out of the primary fan beam and is corrected in real time by adjusting the position of a collimator for the primary beam. Long-term changes in the focal spot position are corrected by using information from the beam-position detector to recalibrate the focal spot-beam collimator data set.

Computed tomography system with stable beam position

A high temperature gas flow sensing element is disclosed having a housing with similar internal dimensions as the fluid conduit, whether round or rectangular. An interior flow conditioner is affixed at the inlet of the flow element. A total pressure sensing pitot tube array is affixed traversing the interior cross sectional area of flow element for sensing the total pressure of fluid flowing into the flow element, and a static pressure sensing pitot tube array is also affixed traversing the interior cross sectional area of the flow element for sensing the average static pressure within the flow element. The pitot tubes and pressure sensing tubes are affixed at four places, two shell penetrations and two places at the manifolds, regardless of manifold design or the element shape. To prevent material stress and fatigue and leakage that can result from the different expansion rates of differing materials under high gradient temperature cycling, a high temperature packing, such as a ribbon packing or packing ring made of pliable material resistant to high temperatures, is used in place of the ferrule portion of a compression nut and fitting arrangement. Exterior first and second instrument taps are provide for connection of each array respectively to a differential pressure instrument for indicating flow rate and/or transmitting a flow rate signal. Further, exterior array access ports are provided to permit cleaning of each pitot arrays should they become plugged with particulates.

Growing community of inventors

Lakewood, OH, United States of America

James R Bowers