Skyworks Solutions, Inc.

Entek Manufacturing LLC

Amtek Research International LLC

Other

Rockwell International Corporation

Intel Corporation

United States of America As Represented by the Secretary of the Air Force

Ppg Industries, Inc.

Sirf Technology, Inc.

Evans Products Company

Skyworks, Inc.

James Phillip Young

Ying Shi

David Steven Ripley

Peter E Johnson

Daniel E Weerts

Francis E Alexander

Leo John Wilz

Robert E Howard

Jinghang Feng

Daniel Lee Kaczman

Netsanet Gebeyehu

Shuqi Zheng

David Richard Pehlke

Philip John Lehtola

David Alan Brown

James Henry Ross

Matthew Lee Banowetz

Akbar Ali

Jonathan Christian Crandall

Joel Anthony Penticoff

Gregory A Blum

Ali J Mahmud

Russell David Wyse

Steven A Gronemeyer

Russ Alan Reisner

Richard W Pekala

Dennis D Leatherman

Haibo Cao

Robert J Weber

Larry T Keith

Daniel K Lee

James E Emanuel

Nai-Shuo Cheng

Gary S Bechman

Edward J Anthony

Gregory T Humphrey

Charles H Geissel

Piotr Zenczak

G Robert Kaelin

Gary L Rohret

Russell W DeHoedt

Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.

Devices and methods related to radio-frequency filters on silicon-on-insulator substrate

Methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, a method of manufacturing a radio-frequency device can include providing a semiconductor die including a radio-frequency circuit, a first side and a second side, and a plurality of vias, each via configured to provide an electrical connection between the first side and the second side of the semiconductor die. The method can further include mounting a filter device on the first side of the semiconductor die, the filter device in communication with the radio-frequency circuit, the radio-frequency circuit implemented in a layer on the first side of the semiconductor die and at least some of the vias coupled with the radio-frequency circuit to support an electrical connection between the radio-frequency circuit and mounting features on the second side of the semiconductor die.

Methods related to radio-frequency filters on silicon-on-insulator substrate

According to some implementations, a radio-frequency (RF) device includes a communication interface coupled to a serial bus. The RF device also includes a monitoring component coupled to the communication interface, the monitoring component configured to monitor the serial bus for first data transmitted to a first device coupled to the serial bus and configure the RF device based on the first data.

Devices and methods for monitoring a serial bus

A deck mount fishing rod holder apparatus for securing fishing rods without clamps includes a base having a base top side, a base bottom side, a mounting portion and a plurality of arm portions. A plurality of mounting apertures receives an engagement portion of a seat post of a seat on a boat to secure the base to rest on a deck of the boat. A plurality of rod holders is pivotably coupled to the base top side of the arm portions. A holder bottom side of each rod holder is angled to rest flush on the base top side in a fish position. A cylindrical holder sidewall extends away from the base top side at an angle greater than 90&#xb0;. Each rod holder secures a fishing rod and is pivotable back towards the base top side to allow for hook setting without removing the fishing rod.

Deck mount fishing rod holder apparatus

Systems, devices and methods related to multi-band power amplifier. In some embodiments, a power amplifier module includes a power amplifier having an output stage and configured to receive a signal. The power amplifier module also includes a first programmable harmonic termination circuit in electrical communication with the output stage of the power amplifier. The first programmable harmonic termination circuit includes a first plurality of capacitors and a first plurality of switches, with at least one of the first plurality of capacitors being in electrical communication with at least one of the first plurality of switches. The power amplifier module further includes a controller configured to modify a configuration of the first plurality of switches of the first programmable harmonic termination circuit based at least in part on a second harmonic frequency of the signal.

Devices and methods related to multi-band power amplifier

Circuits, devices, and methods for monitoring a serial bus

A switch control circuit includes a positive voltage bias node, a voltage-regulated positive supply rail coupled to the positive voltage bias node, a charge pump coupled to a charge pump supply node, and a current source positive supply rail coupled to the charge pump supply node and configured to supply the charge pump.

Switch biasing using isolated negative and positive bias circuitry

Multi-band power amplifier

Aspects of this disclosure relate to systems and methods of performing dynamic impedance tuning. Certain aspects may be performed by or include a dynamic impedance matching network. The dynamic impedance matching network can determine a desired output power for a power amplifier, true power information for the power amplifier, and an output power delivered to a load by the power amplifier. In addition, the dynamic impedance matching network can determine whether the output power satisfies the true power information. Responsive to this determination, the dynamic impedance matching network may modify a load line impedance for the power amplifier using an impedance tuning network.

Automatic impedance matching using true power information

A switch bias control circuit includes a level shifter and voltage regulator circuitry configured to receive a voltage reference signal, provide a first voltage output at a first node and provide a second voltage output at a second node, the first node and the second node being at least partially isolated from one another. coupling circuitry couples the first node to the level shifter and couples the second node to a negative voltage generator.

Radio frequency switches with reduced clock noise

According to one aspect, embodiments of the invention provide a wireless device comprising an overstress indicator circuit including a sense circuit configured to monitor a parameter of the wireless device and generate a sense signal corresponding to the parameter, a detection circuit configured to receive the sense signal from the sense circuit and generate a detection signal in response to a determination that the sense signal is indicative of an overstress condition in the device, an interface circuit, and a memory circuit coupled to the detection circuit and the interface circuit and configured to store an overstress condition indication for access via the interface circuit in response to receiving the detection signal, at least one power amplifier coupled to the interface circuit, and a transceiver coupled to the at least one power amplifier and configured to produce an RF transmit signal and to receive an RF receive signal.

Wireless device with overstress indicator

According to one aspect, embodiments of the invention provide an overstress indicator circuit comprising a sense circuit configured to monitor a parameter of a device and generate a sense signal corresponding to the parameter, a detection circuit coupled to the sense circuit and configured to receive the sense signal from the sense circuit and generate a detection signal at a first level in response to a determination that the sense signal is indicative of an overstress condition in the device, an interface circuit, and a memory circuit coupled to the detection circuit and the interface circuit and configured to store an overstress condition indication for access via the interface circuit in response to receiving the detection signal at the first level.

Overstress indicator

Growing community of inventors

Cedar Rapids, IA, United States of America

James Phillip Young