Temptronic Corporation

James Pelrin

Kenneth M Cole, Sr

Michael F Conroy

Edward Lowerre

Norbert Elsdoerfer

Dana G Butcher

Douglas E Hudson

Norbert W Elsdoerfer

Richard B Gates

A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Temperature-controlled enclosures and temperature control system using the same

An environmental chamber system and a method for testing a device under test (DUT) include an environmental chamber in which the DUT can be tested. A temperature sensor senses temperature of the DUT, the temperature sensor generating a signal indicative of temperature of the DUT. A controller receives at least one input signal related to at least one of temperature and humidity in the chamber and the signal indicative of temperature of the DUT and provides at least one control signal for adjusting at least one of temperature and humidity in the chamber, such that the temperature of the DUT is not below a dew point of an environment in the chamber in a region of the chamber near the DUT, such that condensation in the environment in the chamber in the region near the DUT does not occur.

Environmental test system and method with in-situ temperature sensing of device under test (DUT)

A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature. Also, the spacers provided additional mechanical stability to the chuck, resulting in improved flatness of the chuck upper surface over temperature. To provide additional stability and improve performance over temperature, the thermoelectric modules can be made effectively smaller. This can be done by segmenting the modules into multiple segments or by providing a plurality of submodules connected together.

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Taunton, MA, United States of America

James Pelrin