Freescale Semiconductor,inc.

Motorola Corporation

James Patrick Johnston

Kevin John Hess

Chu-Chung Lee

Tu-Anh N Tran

James W Miller

Bryan D Marietta

Heng Keong Yip

James F Wenzel

Robert Keith DeHaven

Kian Leong Chin

An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.

Integrated circuit package with voltage distributor

A packaging assembly (), such as a ball grid array package, is formed which distributes power across an interior region of an integrated circuit die () by using an encapsulated patterned leadframe conductor () that is disposed over the die () and bonded to a plurality of bonding pads () formed in a BGA carrier substrate () and in the interior die region, thereby electrically coupling the interior die region to an externally provided reference voltage.

Power lead-on-chip ball grid array package

A bump-bonded multi-chip flip-chip device (100) is formed by manufacturing a mother chip (102) having a first set (207) of bumps (212) and a second set (209) of bump contacts (210). A daughter chip (104) is also formed which has conductive bumps (312). The daughter chip (104) and the mother chip (102) are placed face-to-face and contact is made between the daughter chips bumps (312) and the mother chips bump contact regions (210). After interconnection of the daughter chip (104) and the mother chip (102), the mother chip (102) is contacted to an IC package (106) using the bumps (212). The package (106) uses a plurality of metallic layers interconnected selectively by conductive vias in order to route signals between the mother chip (102), the daughter chip (104), and external terminals (112) of the package (106).

Multi-chip semiconductor device and method for making the device by

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Austin, TX, United States of America

James Patrick Johnston