Intel Corporation

James Panakkal

Min Suet Lim

Jaejin Lee

Krishnakumar Varadarajan

Anand Reddy

Harish Jagadish

Naveen Kumar

Aiswarya M Pious

Madhukar Patil

Guru Prakash

Suresh V Subramanyam

Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.

Electromagnetic interference shielding enclosure with thermal conductivity

Hinged electronic device

Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.

Rotational to translational locking hinge

Growing community of inventors

Bengaluru, India

James Panakkal