Agilent Technologies, Inc.

James P Stephens

Lewis R Dove

Michael T Powers

Michael B Whitener

Xiaohui Qin

Jim Clatterbaugh

Robert E Alman

Deji Akinwande

Robin Zinsmaster

Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center conductor, and a second bond wire extends from the other edge of the first center conductor to the other edge of the second center conductor. Embodiments include center conductors at different heights and having different widths, and different electrical devices, such as semiconductor integrated circuits. In a particular embodiment, ball bonding is used. In some embodiments, a tack bond is included after a ball bond to allow closer attachment of the bond wire to the edge of the conductor.

Electrical interconnection for high-frequency devices

An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.

Apparatus and method to introduce signals into a shielded RF circuit

Growing community of inventors

Sebastopol, CA, United States of America

James P Stephens