Dow Global Technolgoies LLC

The Dow Chemical Company

International Business Machines Corporation

Angus Chemical Company

Oxazogen, Inc.

James P Godschalx

Paul H Townsend, Iii

Kenneth J Bruza

Qing Shan J Niu

Edward Otto Shaffer, Ii

Kevin J Bouck

Dennis W Smith, Jr

Q Jason Niu

Steven J Martin

Robert E Hefner, Jr

David A Babb

Zenon Lysenko

Duane R Romer

Clark H Cummins

Michael E Mills

James L Hedrick

Robert Dennis Miller

Craig Jon Hawker

Muthumanickam Sankarapandian

Willi Volksen

Jeffrey Curtis Hedrick

Edmund P Woo

Teddie Peregrino Magbitang

Shaoguang Feng

H Craig Silvis

Eric F Connor

Ray E Drumright

Maurice J Marks

Daniel J Murray

Victor Yee-Way Lee

Christy Sensenich Tyberg

Kim Eric Arndt

David J Brennan

Stephen E Bales

Abel Mendoza

Kevin E Howard

Michael Inbasekaran

Petar Radivoj Dvornic

Muthiah N Inbasekaran

Dean M Welsh

Robert A Devries

Ying Hung So

Ming-Biann Liu

Kenneth L Foster

Gary R Buske

Matthew T Bishop

Ernest L Ecker

James Todd Pechacek

G David Green

Gerald C Kolb

Mitchell G Dibbs

Abhijit Sarkar

Daniel M Scheck

Harry Craig Silvis

Philip C Yang

Paul Henson Townsend

Stoil Dirlikov

Peter D Aldrich

Qingshan J Niu

Alfred Caldecourt

Patricia A Schrader

This invention concerns a polymer coating composition for use as non-focal optical power limiting dye containing polymeric materials. This composition contains: (1) one or more Modified Polymers comprising a Polymer, such as a hyperbranched polymer family, especially HB-PCS, HB-PU, HB-PUSOX or PC with one or more of: a) reverse saturable dye (RSA), b) multi-photon absorption dye (MPA), c) an azo dye, or d) absorption dye, which dye is chemically bonded to the pendant groups of the Polymer (along its chain and/or termini) or which forms a part of the backbone of the Polymer; (2) carbon nanotubes (CNT) as optical power limiters (OPL); and (3) a self-focusing component.

Polymeric dye for optical power limiting

A process for preparing isoxazole compounds of formula I: in which a nitroaryl of the formula (II): is contacted with an alkyl acetoacetate of the formula (III) or a salt thereof: in the presence of an activating agent and a base to provide the isoxazole compound.

Process for preparing isoxazole compounds

This invention is a monomer comprising at least two dienophile groups and at least two ring structures which ring structures are characterized by the presence of two conjugated carbon-to-carbon double bonds and the presence of a leaving group L, wherein L is characterized that when the ring structure reacts with a dienophile in the presence of heat or other energy sources, L is removed to form an aromatic ring structure. This invention is also curable oligomers and polymers and highly cross-linked polymers made with such monomers. Moreover, this invention is a method of making porous films by combining such monomers or their oligomers with a porogen, curing the polymer and removing the porogen.

Multifunctional monomers and their use in making cross-linked polymers and porous films

The present invention relates to a method for preparing polymeric films, preferably electroactive films, with enhanced physical properties by the steps of applying to a substrate a solution of a polymer containing pendant labile solubilizing groups, then removing the solvent and a sufficient concentration of the labile solubilizing groups render the polymer less soluble in the solvent than before the labile groups were removed. It is believed that the removal of pendant soluble groups a) permits optimization of the semiconducting backbone for charge transport performance, b) allows direct control of microstructure in the final film, and c) renders the final film more robust during subsequent process steps needed to construct multilayer devices.

Method of preparing an insoluble polymer film on a substrate from a soluble polymer containing labile solubilizing groups

A monomer suitable for use in forming low dielectric constant films in semiconductor devices comprising i) two dienophile groups (A-functional groups) attached to a single aromatic ring and ii) a second ring structure comprising two conjugated carbon-to-carbon double bonds and a leaving group L (B-functional group), characterized in that said single aromatic ring is directly covalently attached to one of the double bonded carbons of the B functional group or to a fused aromatic ring containing two such double bonded carbons of the B-functional group, and one A-functional group of one monomer is capable of reaction under cycloaddition reaction conditions with the B-functional group of a second monomer to thereby form a polymer.

Multifunctional unsymmetrically substituted monomers and polyarylene compositions therefrom

A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.

Porous composition of matter, and method of making same

A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tof greater than 300&#xb0; C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

A crosslinked polyarylene material with a reduced coefficient of thermal expansion at high temperatures compared with conventional crosslinked polyarylene materials is provided. In addition, an integrated circuit article containing a crosslinked polyarylene polymer with reduced coefficient of thermal expansion at high temperatures is provided.

Composition and method to achieve reduced thermal expansion in polyarylene networks

A cured polyphenylene polymer having a glass transition temperature no greater than 465&deg; C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-m .

Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers

A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a T of greater than 300&deg; C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300&deg; C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.

Polyarylene compositions with enhanced modulus profiles

An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.

Polyphenylene oligomers and polymers

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Midland, MI, United States of America

James P Godschalx