Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

James Nystrom

Hung-Chin Guthrie

Quang Le

Jian-Huei Feng

Systems and methods for aligning wafers within wafer processing equipment. In a first embodiment, a wafer alignment nozzle comprises a fixed cylindrical member. A moveable cylindrical member is disposed with the fixed cylindrical member in a sliding fit. The moveable cylindrical member comprises a plurality of angled fluid orifices for directing a plurality of streams of the fluid onto a surface of the wafer.

Method for aligning wafers within wafer processing equipment

A moisturizing process for slurry delivery tubes in chemical mechanical polishing is disclosed. A mist of deionized water is dispensed directly into the tubes each time a high pressure spray bar automatically cycles. The tips of the tubes are kept wet enough to prevent the slurry from drying in and clogging the tubes. A fan-type spray nozzle is located in the bar and, when pressurized, dispenses a fine mist. A direction of the nozzle is modified to avoid overspraying the tool. Only the tips of the delivery tubes and part of the polishing pad receive the misted spray. The slurry is moisturized and never dries at the point of use as the mist is dispensed with each cycle of a pad rinse feature.

Growing community of inventors

Sunnyvale, CA, United States of America

James Nystrom