General Electric Company

Sensor Networks, Inc.

Ge Inspection Technologies, Gmbh

James Norman Barshinger

Mark Howard Feydo

Thomas James Batzinger

Jeffrey S Anderson

Richard Eugene Klaassen

Bruce A Pellegrino

Robert S Gilmore

Edward James Nieters

Wei Li

Ying Fan

Debasish Mishra

Jian Ying Li

Wei Luo

Anusha Rammohan

Nicholas Joseph Kray

Bruno Hans Haider

John Broddus Deaton, Jr

Francis Howard Little

Waseem Ibrahim Faidi

Prabhjot Singh

William Thomas Hatfield

Nathan Smith

Patrick Joseph Howard

Stephan Falter

Yanyan Wu

Matthew Harvey Krohn

Sivaramanivas Ramaswamy

Michael John Danyluk

Sandeep Kumar Dewangan

Paul Aloysius Meyer

Carl Lawrence Chalek

John Michael Cuffe

Michael Everett Keller

Dirk Lange

Fred Timothy Matthews

Kelley E Yetter

Robert John McElligott

David Charles Copley

David Paul Lappas

David Charles Franklin

Brian Van Corcelius

Werner Lammerich

Timothy Jesse Sheets

Matthew Krohn

Fred Matthews

Robert Snee Gilmore

Eugene Klaassen Richard

Robert John Mceilligott

A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the first and second signals between the transducer and the DSI, the elongated member being configured to offset the low-temperature portion a sufficient distance away from the high-temperature portion such that the low-temperature portion is subjected to significantly less heat from the structure compared to the high-temperature portion.

High-temperature ultrasonic sensor

An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising: a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to said first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to said reflected ultrasound signal, said first and second electrical signals being analog; and at least one digital sensor interface (DSI) to which at least a portion of said sensors are connectable, said DSI being configured to transmit said first electrical signal and receive said second electrical signal, and to generate at least an A-scan signal based on said first and second electrical signals for each sensor, said DSI having a cellular transceiver for transmitting a cellular signal based directly or indirectly on at least said A-scan signal, said cellular signal including an address corresponding to said at least one DSI.

Asset integrity monitoring using cellular networks

An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising (a) a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to the first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to the reflected ultrasound signal, the first and second electrical signals being analog; (b) at least one digital sensor interface (DSI) to which at least a portion of the sensors are connectable, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals for each sensor, the DSI having circuitry for transmitting a digital signal based directly or indirectly on at least the A-scan signal, the digital signal including an address corresponding to the at least one DSI; (c) a digital bus configured to receive the digital signal from the at least one DSI; (d) a user interface connected to the bus to receive the digital signal; and wherein, in one embodiment, the sensors are mounted semi-permanently on the structure and the DSI is also mounted semi-permanently on or adjacent to the structure being monitored.

Asset-condition monitoring system

A method of releasably adhering an ultrasonic sensor to a structure, the structure having an operating temperature range, the method comprising: applying a coupling agent between the structure and the sensor at an installation temperature, the coupling agent having a glass transition temperature (Tg) below the operating temperature range and below the installation temperature, the coupling agent being in a viscous/viscoelastic state over the operating temperature range; and urging the sensor against the structure with the coupling agent therebetween such that the sensor adheres to the structure.

Ultrasound coupling material and method of use

A sensor for ultrasonically measuring a portion of a structure, the sensor comprising: a transducer for converting an analog transmit signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to an analog reflected signal; a housing integrated with the transducer and containing at least: a processor; a wireless data transmitter for transmitting wirelessly a data signal from the processor; a transmit and receive circuit for transmitting an analog transmit signal to the transducer in response to a transmit trigger from the processor, and for receiving an analog reflected signal from the transducer; an A/D converter for digitizing only a portion of the analog reflected signal in response to a sample trigger from the processor; a battery to supply power to the processor, the wireless data transmitter, the transmit and receive circuit, and the A/D converter; memory operatively connected to the processor and configured to instruct the processor to execute the following steps: repeatedly triggering the transmit and receive circuit and the A/D converter to obtain a digitized composite signal through time-equivalent sampling; processing the digitized composite reflected signal to generate an A-scan signal; and wirelessly transmitting the data signal based on the A-scan signal for transmission to a discrete collection device.

Low-power wireless device for asset-integrity monitoring

Systems and methods are disclosed herein in which multi-level square wave excitation signals are used instead of or in addition to fully-analog excitation signals to drive an array of transceiver elements to create a sound field. Use of multi-level square wave excitation signals produces acceptable transceiver output with reduced complexity, cost, and/or power consumption as compared with use of fully-analog excitation signals. In addition, use of such signals facilitates system implementation using application-specific integrated circuits (ASICs) and is not as restricted in voltage level and speed. At the same time, the benefits and applications of fully-analog excitation signals (e.g., acoustic holography, beam superposition, signal-to-noise ratio (SNR) improvements, suppression of parasitic modes, increased material penetration, potential for coded pulsing algorithms and suppression of side lobes in ultrasonic field) can still be achieved with multi-level square wave excitation signals.

Acoustical holography with multi-level square wave excitation signals

An ultrasonic sensor assembly for testing a pipe includes a first and second transducer rings attached to the pipe and spaced apart along a length of the pipe. The first transducer ring includes a plurality of transmitters for transmitting a wave, such as a non-dispersive guided wave. The first transducer ring transmits the wave along the pipe. The second transducer ring includes a plurality of receivers for receiving the wave. A relative position of the first transducer ring with respect to a circumferential position of the second transducer ring is determined based on characteristics of the wave received by the second transducer ring. A method of positioning the ultrasonic sensor assembly on the pipe is also provided.

Sensor positioning with non-dispersive guided waves for pipeline corrosion monitoring

An ultrasonic sensor assembly detects a characteristic of a pipe. The ultrasonic sensor assembly includes first and second transducer rings spaced apart along a length of the pipe. Each of the first and second transducer rings can transmit a first wave longitudinally along the pipe and receive a reflection of the transmitted first wave from the characteristic. The first transducer ring can use results related to the reflection of the transmitted first wave to guide a second wave along the pipe that is received by the second transducer ring. Methods of detecting a characteristic of the pipe are also provided.

Method and apparatus for inspecting and monitoring pipe

A method for performing ultrasonic testing comprising, in one embodiment, the steps of firing an ultrasonic transducer to generate an ultrasonic pulse that passes through a delay line, measuring a delay echo time of flight, and determining the temperature of the delay line using the delay echo time of flight, thereby eliminating the need for additional temperature measuring devices. Other embodiments further comprise the step of using the temperature of the delay line to determine the temperature of a test object, and using the temperature of the test object to determine a thickness of the test object that is compensated for thermal expansion and temperature dependent ultrasonic velocity.

Method for performing ultrasonic testing

A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120&#xb0; C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material.

Device and system for measuring material thickness

An ultrasound inspection system is provided for inspecting an object. The inspection system includes an ultrasound probe configured to scan the object and acquire a plurality of ultrasound scan data. The inspection system further includes a processor coupled to the ultrasound probe and configured to apply a transfer function to the ultrasound scan data to compensate for distortion of a plurality of ultrasound signals through the object and thereby generate a plurality of compensated ultrasound scan data, and to process the compensated ultrasonic scan data to characterize a feature in the object.

Systems and methods for inspecting an object using ultrasound

An acoustic stack for ultrasonic transducers comprising a backing block, flexible printed circuit board, piezoelectric ceramic layer, and acoustic matching layer. The various components of the acoustic stack are bonded together using an adhesive material and high pressure in a lamination process. The piezoelectric ceramic layer is manufactured to provide electrical and acoustic isolation without the need for dicing through multiple layers of the acoustic stack. A flex circuit provides the necessary electrical connections to the electrically isolated electrodes of the piezoelectric ceramic layer.

Acoustic stack for ultrasonic transducers and method for manufacturing same

In accordance with one embodiment, the present technique provides a testing apparatus for testing material integrity of an object. The exemplary testing apparatus includes a phased array transducer, which is disposed external to the object. The phased array transducer is configured to transmit a first set of ultrasonic signals and to receive a second set of ultrasonic signals. The testing apparatus further includes logic circuitry coupled to the phased array transducer. The logic circuitry is configured to dynamically control apertures for transmitting the first set of ultrasonic signals and receiving the second set of ultrasonic signals based on a region of interest and a testing speed.

Method and apparatus for phased array based ultrasonic evaluation of rail

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Scotia, NY, United States of America

James Norman Barshinger