International Business Machines Corporation

Lenovo (Singapore) Pte. Ltd.

Avx Corporation

James N Humenik

John Ulrich Knickerbocker

Govindarajan Natarajan

David Clifford Long

Krishna Gandhi Sachdev

Charles Hampton Perry

Jon Alfred Casey

Glenn A Pomerantz

Scott Partington

Emmanuel Delamarche

Thomas Weiss

Eric Alan Eckberg

Mark J LaPlante

Robert W Nufer

Timothy M Wiwel

Arnold I Baise

Kathleen A McGroddy-Goetz

Marco Giovanni Trivella

Christopher F Perrera

Sarah Huffsmith Knickerbocker

Srinivasa S Reddy

Mark A Takacs

John Acocella

Steven M Kandetzke

Renuka S Divakaruni

Michael E Cropp

Richard A Bates

James C Utter

Anthony Mastreani

David R Clarke

Lovell B Wiggins

Daniel P Kirby

Salvatore J Scilla

Amy T Matts

Werner E Dunkel

Allen J Dam

Ray M Bryant

Benjamin V Fasano

Raschid Jose Bezama

Lester W Herron

David Lewis Gardell

Lawrence D David

Rao Venkateswara Vallabhaneni

Daniel George Berger

Ajay Prabhakar Giri

Philip L Flaitz

Chon Cheong Lei

Candace A Sullivan

George Czornyj

Donald W Diangelo

Daniel S Mackin

John T Butler

John F Harmuth

Peter A Agostino

Cynthia J Calli

Liang-Choo Hsia

Bruce E Tripp

David E Speed

Robert W Churchwell

Hilton T Toy

Kamal Kumar Sikka

Sushumna Iruvanti

John L Galvagni

Andrew Ramsay Knox

Shaji Farooq

Thomas Edward Lombardi

Brian Michael Erwin

Robert Rosenberg

Janusz S Wilczynski

Rajneesh Kumar

David B Goland

Mark William Kapfhammer

Robert William Pasco

Dinesh Gupta

Srinivasa S N Reddy

Hsichang Liu

Keith C O'Neil

Jawahar P Nayak

Renee L Weisman

Umar M Ahmad

Gregg B Monjeau

Richard D Langlois

Robert J Sullivan

Jiantao Zheng

Rao R Tummala

William E Dougherty, Jr

David H Gabriels

James M Oberschmidt

Gerald H Leino

Mark R LaForce

Jimmie L Powell

James Robert Wylder

John A Trumpetto

Ekkehard F Miersch

Irving Feinberg

Deborah Anne Sylvester

Alan Platt

James M Blazick

Frank V Ranalli

John Lawson

An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.

Micro-fluidic test apparatus and method

Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115&#xb0; C. without staining or leaving residue on the device under test after baking.

Thermal interface material, test structure and method of use

A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.

Fully automated paste dispense system for dispensing small dots and lines

A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

Reliability enhancement of metal thermal interface

An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the at least one micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.

Fully automated paste dispense process for dispensing small dots and lines

An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.

Fluidic test apparatus and method

Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.

Systems and methods for cooling an electronic device

An apparatus and a method are disclosed for providing point of care testing for osmolarity of a bodily fluid. An apparatus is disclosed as having a fluid pathway passing through it for receiving and testing a sample fluid. The invention permits osmolarity testing of a sample fluid wherein the sample fluid has a volume of less than approximately 30 nL, and implements a method and device to measure fluid osmolarity in a clinical setting quickly and accurately, while also reducing evaporation of the fluid.

Method and apparatus for point of care osmolarity testing

A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.

Method of forming a plate for dispensing chemicals

A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

Semi-aqueous solvent cleaning of paste processing residue from substrates

A method and structure for filling an opening in a substrate which includes positioning a sheet above the substrate and punching the sheet into the opening in the substrate, wherein the sheet and the substrate have similar shrinkage characteristics when subjected to a subsequent sintering process.

Powder metal polymer organic sheet punching for substrate conductors

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Lagrangeville, NY, United States of America

James N Humenik