Globalfoundries U.S. Inc.

James Mazza

Elizabeth Strehlow

David C Pritchard

Jia Zeng

Xuelian Zhu

Mahbub Rashed

Navneet Jain

Anton Tokranov

Hong Yu

Juhan Kim

Heng Yang

Hongru Ren

Kai Sun

Mohamed Rabie

Jay A Mody

Motoi Ichihashi

Romain H A Feuillette

Romain Feuillette

Harold Mendoza

Clynn J Mathew

Yea-Sen Lin

The present disclosure relates to semiconductor structures and, more particularly, to antenna structures and methods of manufacture. The structure includes an antenna cell comprising a single P-well isolated by a deep trench isolation structure and including at least one diffusion region.

Antenna structure

The present disclosure relates to semiconductor structures and, more particularly, to local interconnect power rails merged with upper power rails and methods of manufacture. The structure includes: an active cell including contacts enclosed in active regions; at least one local interconnect power rail connecting to the contacts of the active regions; and at least one power rail above and connected to the at least one local interconnect power rail.

Local interconnect power rails and upper power rails

Structures with features formed by self-aligned double patterning and methods of self-aligned multiple patterning. The structure comprises a first field-effect transistor including a first gate and a first protrusion projecting laterally from the first gate, and a second field-effect transistor including a second gate and a second protrusion projecting laterally from the second gate. The second gate and the second protrusion are spaced in a lateral direction from the first gate and the first protrusion. The structure further comprises a gate contact connecting the first protrusion of the first gate to the second protrusion the second gate.

Self-aligned double patterning with mandrel manipulation

The present disclosure relates to semiconductor structures and, more particularly, to a logic cell layout design for high density transistors and methods of manufacture. The structure includes a plurality of active gates in a high density transistor, and at least one dummy gate which is continuous and is adjacent to at least one active gate of the active gates in a multi-row cell of the high density transistor.

Logic cell layout design for high density transistors

Disclosed are a motion-sensitive field effect transistor (MSFET), a motion detection system, and a method. The MSFET includes a gate structure with a reservoir containing conductive fluid and gate electrode(s). Given position(s) of the gate electrode(s) and a fill level of the fluid within the reservoir, contact between the gate electrode(s) and the fluid depends upon the orientation the MSFET channel region relative to the top surface of the conductive fluid and the orientation of the MSFET channel region relative to the top surface of the conductive fluid depends upon position in space and/or movement of the MSFET and, particularly, position in space and/or movement of the chip on which the MSFET is formed. An electrical property of the MSFET in response to specific bias conditions varies depending on whether or not or to what extent the gate electrode(s) contact the fluid and is, thus, measurable for sensing chip motion.

Motion-sensitive field effect transistor, motion detection system, and method

An illustrative device disclosed herein includes a semiconductor substrate and a FinFET transistor device positioned above the semiconductor substrate, wherein the FinFET transistor device has a single active fin structure. The device also includes an electrically inactive dummy fin structure positioned adjacent the single active fin structure, wherein the electrically inactive dummy fin structure is electrically inactive with respect to electrical operation of the FinFET transistor having the single active fin.

IC product comprising a single active fin FinFET device and an electrically inactive fin stress reduction structure

An integrated circuit (IC) structure with a single active region having a doping profile different than that of a set of active regions, is disclosed. The IC structure provides a single active region, e.g., a fin, on a substrate with a first doping profile, and a set of active regions, e.g., fins, electrically isolated from the single active region on the substrate. The set of active regions have a second doping profile that is different than the first doping profile of the single active region. For example, the second doping profile can have a deeper penetration into the substrate than the first doping profile.

IC structure with single active region having different doping profile than set of active regions

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Saratoga Springs, NY, United States of America

James Mazza