International Business Machines Corporation

James M Moniz

Carl Stuebing

Xiangdong Zhang

David R Helms

Joshua C Park

Phillip Antognetti

Scott Munro

Jim Griffiths

Dale K Jadus

Colin Ruhe

Joseph Pusl

Paul J Pannaccione

A bias network for a radio frequency signal power amplifier. A current source is connected to a source of band gap voltage and produces a current proportional to the voltage. A reference voltage circuit receives the current and produces a voltage which is proportional to the current, as well as changes in temperature. An operational amplifier is used to connect the reference voltage to the power amplifier, so that the power amplifier is effectively isolated from the reference voltage circuit and current bearer circuit. A power amplifier breakdown protection circuit is connected across the output of the operational amplifier for diverting avalanche current produced form the power amplifier away from the power amplifier when the power amplifier output is mismatched through the antenna. Baseband signal transmission from the power amplifier to the bias network circuit is also significantly reduced, thus avoiding the generation of spurious radiation components.

Active bias network circuit for radio frequency amplifier

A chip scale package with outer dimensions for high of semiconductor chips to facilitate handling, testing, and later attachment of the package to further electrical circuitry. The chip scale package has four main components: semiconductor chip, a lead frame, a connection between the semiconductor chip and the lead frame, and an encapsulation sealing the semiconductor chip from the surrounding atmosphere. The semiconductor chip has a body, an active surface, and the dimensions that are between about 70% and 80% of the outer dimensions of the chip scale package. The lead frame has an intermediate path directly in line with, and perpendicular to, the surface of the semiconductor chip, thereby minimizing parasitic inductance and capacitance, and a thermal or ground slug.

Chip scale package with direct attachment of chip to lead frame

A radio frequency power amplifier for a battery powered handset unit of a wireless communications system having a low power signal amplification path and a high power signal amplification path. Logic and biasing means within the handset select between the low power signal path and the high power signal depending upon the handset being within or outside a prescribed distance from a base station. In this way, the signals received at the base station from the handset are at the required power level.

Radio frequency power amplifier for a battery powered handset unit of a wireless communications system

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Poughquag, NY, United States of America

James M Moniz