Other

Polyone Corporation

Fry's Metals, Inc.

Solvay Advanced Polymers, LLC

Alpha Metals, Inc.

James M Hurley

Rajan Hariharan

Senthil Kanagavel

Deborah Makita

Martin Sobczak

Jose Quinones

Mark Wilson

Erik M Saly

Bruce Howard Bersted

James Kevin Seagraves

Xiaoyun Ye

Yixin Yang

A golf club that is used to practice a golf swing. Specifically, the golf club includes a handle and a head coupled to the handle. The head is formed from a first portion and a second portion that are coupled together. The first portion may be formed of a rigid material and the second portion may be formed of a resilient material. The second portion may comprise bristles or some other soft, pliable, compressible material that will not damage a surface upon contact during swinging the golf club. The golf club head preferably has the same shape as a traditional golf club head of the same type. However, the second portion forms the sole of the head, thereby eliminating the potential for damage to a floor surface during swinging of the golf club.

Practice golf club

A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.

Conductive compositions and methods of using them

Plastisol compositions having a two-resin interpenetrating polymer network (IPN) are disclosed. The compositions begin with blocked isocyanate grafted acrylic polymer, blocked isocyanate urethane prepolymer, plasticizer, optionally pigment, and optionally thixotropic agent. When subjected to a thermal cure, the isocyanate groups on the acrylic polymer and urethane prepolymer both become unblocked and both react with the crosslinking agent to form an interpenetrating acrylic-polyurethane network. The two-resin IPN offers improved storage stability, hand-feel characteristics, and processing properties for textile printing among other uses. Preferably these plastisol compositions are essentially free of polyvinyl halides and phthalates restricted for regulatory reasons.

Acrylic-urethane IPN plastisol

An anchor apparatus, ground anchor system, and method of using a ground anchor system are provided. The anchor apparatus includes a base plate having a top surface and a substantially planar bottom surface, wherein the base plate has a plurality of picket-guide apertures formed therein between the top surface and the substantially planar bottom surface. At least one picket is removably positioned in at least a portion of the picket-guide apertures. An anchor portion is formed at a first end of the base plate, wherein the anchor portion has an anchor aperture formed through the first end of the base plate, the anchor portion further comprising a ground face surface proximate to the anchor aperture, wherein a distance between the top surface and the ground face surface is less than a distance between the top surface and the substantially planar bottom surface.

Ground anchor system and method of installation

Plastisol compositions are disclosed containing methacrylate core/shell copolymer, non-phthalate ester plasticizers, pigment, filler, and thixotropic agent. Other additives are optional. The plasticizer is a blend of dibenzoate and DINCH. The plastisol can be used an ink of various colors for use in application to textiles. The plastisol compositions avoid polyvinyl chloride polymer resins and phthalate plasticizers conventionally employed in plastisol inks.

Plastisol compositions that are essentially free of polyvinyl halides and phthalates

Mono-acid hybrid conductive composition and method

A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.

Low voiding no flow fluxing underfill for electronic devices

The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing curative comprises a salt that is a reaction product of an imidazole component and a carboxylic acid component having at least 10 carbon atoms per molecule. Additionally, the invention is directed to an underfill solution comprising the fluxing curative and a method of attaching an integrated circuit device using the underfill solution.

Underfill fluxing curative

A composition comprising a high temperature partially aromatic polyamide, an impact modifier, a secondary aryl amine, and a copper stabilizer.

Growing community of inventors

Atlanta, GA, United States of America

James M Hurley