Amkor Technology, Inc.

Honeywell International Inc.

James M Fusaro

Robert Francis Darveaux

Pablo Rodriguez

Joseph J Nutaro

Daniel P Johnson

Steven Wayne Newell

William D Cromer

Lee Davis

Apparatuses, systems and methods are provided for automatically pushing aircraft back from an airport gate and/or for automatically taxiing an aircraft. At least one engines-off drive is attached to at least one landing gear wheel to apply a rotational force and/or a rotation impeding force to the at least one landing gear wheel. At least one friction brake is attached to at least one landing gear wheel to apply a rotation impeding force to the at least one landing gear wheel.

Apparatuses, systems and methods for automatically taxiing an aircraft

A ground remote control system for an aircraft includes a security pairing device configured to establish a first secure communication link and protocol between a remote control device and a ground remote control system controller; and establish a second secure communication link and protocol, using the first communication link and protocol between the remote control device and the ground remote control system controller. The ground remote control system controller is configured to receive drive command signals, brake command signals, steering command signals, and power command signals, from the remote control device and generate the electronic drive commands, the electronic brake commands, the electronic steering commands, and the electronic power commands.

Ground remote control system and method for an aircraft with an electric taxi system

Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite second surface, and apertures between the first and second surfaces. A planar metal die pad and planar metal are attached to the second surface of the polyimide sheet. The apertures in the polyimide sheet are juxtaposed to the leads. A package made using the substrate includes an integrated circuit device mounted above the first surface of the polyimide sheet opposite the die pad. Bond wires are connected between the integrated circuit device and the leads through the apertures in the polyimide sheet. An encapsulant material covers the first surface of the polyimide sheet, the integrated circuit device, the bone wires, and the apertures. The die pad and leads are exposed at an exterior surface of the package.

Integrated circuit device packages and substrates for making the packages

Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite second surface, and apertures between the first and second surfaces. A planar metal die pad and planar metal are attached to the second surface of the polyimide sheet. The apertures in the polyimide sheet are juxtaposed to the leads. A package made using the substrate includes an integrated circuit device mounted above the first surface of the polyimide sheet opposite the die pad. Bond wires are connected between the integrated circuit device and the leads through the apertures in the polyimide sheet. An encapsulant material covers the first surface of the polyimide sheet, the integrated circuit device, the bond wires, and the apertures. The die pad and leads are exposed at an exterior surface of the package.

Methods of making integrated circuit device packages and substrates for making the packages are disclosed. An embodiment of a method of making a substrate includes providing an unpatterned sheet of polyimide material having a first surface and an opposite second surface. A planar metal layer is attached to the second surface of the polyimide sheet. The metal layer is patterned to form an array of package sites, with each site including a planar die pad and planar leads. Apertures are formed through the polyimide sheet, either before or after attaching the metal layer. Each aperture is juxtaposed with a lead allowing access thereto. A method of making a package using the substrate includes mounting an integrated circuit device above the die pad (e.g., on the substrate or on the die pad through an aperture in the substrate). Bond wires are connected between the integrated circuit device and the leads through the apertures. An insulative encapsulant is applied so as to cover the integrated circuit device and fill the apertures. A method of making multiple packages includes a final step of cutting an encapsulated array of package sites with a saw to separate individual packages.

Growing community of inventors

Scottsdale, AZ, United States of America

James M Fusaro