Texas Instruments Corporation

James M Drumm

Arthur M Wilson

Randall E Johnson

Mark A Kressley

Juanita G Miller

Dean L Frew

Philip E Hecker, Jr

Richard L Guldi

Vikram N Doshi

Rick Elder

John E Hanicak

A method of filtering a bath (,) having a liquid containing particles of varying sizes therein and the recirculation and filtering system. The method and system require providing a recirculation route from the bath outflow and returning to the bath inflow. The route includes a first path communicating with the bath outflow and having serially a first controllable valve (,) and a filter having a relatively large pore size. The route also includes a second path communicating with the bath outflow and having serially a second controllable valve (,) and a filter having a relatively small pore size. There is a return path from each filter to the bath inflow. The return path from each filter can be a separate path or the paths can be connected at the output end before returning to the bath. The particle count in the recirculation route can be monitored either between the bath outflow and the first and second valves (,), between the bath inflow and each of the filters having large and small pore size (,), or both for controlling operation of the first and second valves. The controllable valves can also be controlled by a time program, bath operation program or the like.

Method for efficient filtration of chemical baths

A method of making a microelectronic circuit and the connection pattern therefor including the steps of providing a substrate (3), preferably silicon and preferably including a layer of nickel (38) under a layer of gold (36) thereon. Regions are formed on the substrate for connection of electrical components to the substrate using a first metallurgy, preferably gold and a pattern of bumps (5, 7) is formed of a second metallurgy different from the first metallurgy, preferably lead/tin solder. An interconnection pattern is formed on the substrate contacting at least one bump and at least one pad. The pattern of solder bumps is formed by providing a coupon (31) and patterning the bumps on the coupon and applied to the substrate while attached to the coupon, then heated to cause flow of the bumps onto the substrate. The coupon is then removed from the bumps with the bumps remaining on the substrate. Electrical components are applied to the region of first metallurgy and electrically bonded by wire bonding or Tape Automated Bonding techniques. Electrical components are applied to the region of the second metallurgy and electrically bonded by flip-chip technique.

Solder bump transfer for microelectronics packaging and assembly

The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.

Three dimensional assembly of integrated circuit chips

A three dimensional package having at least one semiconductor chip having input/output conductive pads along its periphery includes a dielectric carrier over at least a portion of the chip and a plurality of conductors mounted on the carrier between the chip and the dielectric carrier. The plurality of conductors are mounted within the periphery of the chip with one end connected to the conductive pads and with the other end of the plurality of conductors exiting from the same side of the chip. The plurality of conductors exiting from the same side are electrically coupled to an interconnect substrate.

Assembly of semiconductor chips

Growing community of inventors

Garland, TX, United States of America

James M Drumm