Learonal, Inc.

Shipley Company LLC

James L Martin

Michael P Toben

Stephane Menard

Fred I Nobel

John E McCaskie

David N Michelen

Mark Lefebvre

Leon Barstad

Yasuo Ohta

Yasushi Takizawa

James E Rychwalski

Haruki Enomoto

Robert A Schetty, Iii

Leon R Barstad

Robert A Iii Schetty

The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Electrolytic copper plating method

The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.

Programmed pulse electroplating process

Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates.

Electroless gold plating solution and process

Alkaline aqueous electrolytes for the electrodeposition of palladium comprising a soluble palladium compound, one or more complexing agents of an organic compound containing a heterocyclic ring having one or more nitrogen atoms in the ring position, at least one carboxyl group substituted on a ring carbon, and at least one hydroxyl or carbonyl oxygen attached to a ring carbon. The palladium compound and complexing agents are soluble in the electrolyte. Optionally, one or more soluble alloying metal compounds can be added to the electrolyte when palladium alloys are to be electrodeposited therefrom. Also, methods for formulating these electrolytes and for electrodepositing palladium or palladium alloys therefrom.

Alkaline baths and methods for electrodeposition of palladium and

Methods for increasing the ductility and reducing the porosity and cracking tendency of a palladium or palladium-silver electrodeposit which comprises providing an underlayer of a palladium/nickel or palladium/cobalt alloy electrodeposit. Also dual layer composite electroplated deposits and their use in electrical contacts or connectors.

Electrical contacts and methods of making contacts by electrodeposition

An electroplating bath composition is disclosed which permits high speed palladium deposition. The bath comprises carbonate or phosphate anion in a critical amount and is otherwise additive free. A pH of 7-9 is used.

Palladium plating

The invention relates to a method for high speed palladium electroplating by immersing the object to be plated in an ammoniacal solution of a palladium tetra-amino complex ion, palladium metal in a concentration of at least 10 g/l, and at least one carbonate or phosphate anion in a concentration of more than about 7.5 g/l and less than about 150 g/l. The solution has a pH of between about 7 and 9 and is free of quaternized pyridinium brightening agents. Palladium is plated into a substrate with high speed plating equipment which provides sufficient agitation, and current densities of 100 ASF and above to produce lustrous crack free deposits.

Growing community of inventors

Merrick, NY, United States of America

James L Martin