International Business Machines Corporation

Lexmark International, Inc.

James L Hedrick, Jr

Juan Ayala-Esquilin

Jane M Shaw

Alfred Viehbeck

Jeffrey Curtis Hedrick

Elizabeth F Foster

Stephen L Tisdale

Ali Afzali-ardakani

Rodney T Hodgson

Shahrokh Daijavad

Steven E Molis

Ashit A Mehta

Bodil E Braren

Keith E Fogel

Paul Alfred Lauro

Da-Yuan Shih

Fuad Elias Doany

George Frederick Walker

Leathen Shi

Maurice Heathcote Norcott

John J Ritsko

Jeffrey W Labadie

Brian Samuel Beaman

Willi Volksen

John Campbell Scott

Sally Ann Swanson

James Economy

Donald Clifford Hofer

William Harve Dickstein

Arnold C Yang

Brain S Beaman

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

Fluorinated carbon polymer composites

Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection means is disposed over the array of electronic devices so that the electrical interconnection means is between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection means between adjacent assemblies. The substrate or each assembly is formed from a thermally conductive material such as diamond. A heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure. Methods for fabricating the electrical interconnection means as a stand alone elastomeric sheet are described. The ends of the plurality of conductors in the electrical interconnection means are fabricated so that upon compression between adjacent assemblies there is a wiping action between the conductor ends and contact locations on the adjacent assemblies to form a good electrical contact therewith.

Method of forming a three dimensional high performance interconnection

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.

Three dimensional high performance interconnection package

Hot roll fusers are made with a matrix resin which is an elastomer having a glass transition between 90.degree. C. and 160.degree. C. and a structure represented by the formula X--Ar--Y--Ar--X wherein Ar is an aromatic ring structure, Y is O, S, C.dbd.O, SO.sub.2, C(CH.sub.3).sub.2, C(CF.sub.3).sub.2, CH.sub.2 or (CF.sub.2).sub.n and X is --O--C.tbd.N, --C.tbd.CH or ##STR1##

Hot roll fusers comprising polyarylene elastomers

Block copolymers of polyimide and poly (phenylquinoxaline) have been synthesized. They are useful, particularly as dielectric layers in thin film multilayer structures. The most preferred embodiments are formed from polyimides which are those from pyromellitic dianhydride and oxydianiline. The most preferred poly (phenylquinoxaline) is a monofunctional oligomer, which yields the best microstructure.

Polyimide-poly(phenylquinoxaline) block copolymers

A roll for hot fusing having a coating comprising a cross-linked elastomeric random copolymer of dimethylsiloxane and diphenylsiloxane and three additives, (1) from 40 to 55% by weight of small zinc oxide particles, (2) from 5 to 10% by weight of small graphite particles and (3) from 1 to 5% by weight of ceric dioxide particles.

Coatings for hot roll fusers

Growing community of inventors

Oakland, CA, United States of America

James L Hedrick, Jr