International Business Machines Corporation

James L Carper

Robert M Smith

Gary H Irish

Robert L Jackson

Sheldon C Rieley

David V Caletka

Kibby B Horsford

Gordon C Osborne, Jr

Charles R Ramsey

John James Lajza, Jr

Michael J Vadnais

John P Cincotta

A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

Planarized plastic package modules for integrated circuits

A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.

Leadframe having contact pads defined by a polymer insulating film

Growing community of inventors

Colchester, VT, United States of America

James L Carper