Nxp Usa, Inc.

Macom Technology Solutions Holdings, Inc.

James Krehbiel

Joseph Staudinger

Abdulrhman M S Ahmed

Enver Krvavac

Joseph Gerard Schultz

Yu-Ting David Wu

Michael E Watts

Nick Yang

Mario Bokatius

A semiconductor device package includes a first and a second input lead and a plurality of uniform transistor-based components, the plurality of uniform transistor-based components comprising a first subset of the uniform transistor-based components coupled to the first input lead and a second subset of the uniform transistor-based components coupled to the second input lead. The first subset and the second subset are arranged in an asymmetric configuration with respect to one another.

Device packages with uniform components and methods of forming the same

A circulator-coupler device includes a ferrite element, a resonator over and aligned along an axis with the ferrite element, and a plurality of resonator ports connected to the resonator. The plurality of resonator ports includes first and second resonator ports, and a first portion of a perimeter of the resonator extends between the first and second resonator ports. The circulator further includes a coupler element positioned across a gap from the first portion of the perimeter of the resonator, and a coupler port connected to the coupler element. The device also may include a permanent magnet aligned along the axis with the ferrite element, where the permanent magnet biases the ferrite element and causes a signal conducted through the resonator to have a directionality along a rotational direction that extends from the first resonator port to the second resonator port.

Circulator with integrated directional coupler, and communication systems including the same

Embodiments of a multiple-path amplifier (e.g., a Doherty amplifier) and a module housing the amplifier include a first amplifier (or first power transistor die) with a first output terminal, a second amplifier (or second power transistor die) with a second output terminal, and an impedance inverter line assembly electrically connected between the first and second output terminals. The impedance inverter line assembly includes a first transmission line and a surface mount component connected in series between the first and second output terminals. In various embodiments, the surface mount component is selected from a fixed-value capacitor, a fixed-value inductor, a tunable capacitor, a tunable inductor, and a tunable passive component network.

Multiple-path amplifier with series component along inverter between amplifier outputs

A reference circuit includes an integrated circuit (IC) formed on a semiconductor substrate including a first spiral inductor and a second spiral inductor. The first spiral inductor is formed from a first metal layer over the substrate. The second spiral inductor is formed from a second metal layer. The second spiral inductor is offset from the first spiral inductor and includes a first portion overlapping the first spiral inductor. A first capacitor includes a first terminal coupled to receive a radio frequency (RF) signal and a second terminal coupled to a first terminal of the first spiral inductor, and second capacitor includes a first terminal coupled to a second terminal of the first spiral inductor.

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Chandler, AZ, United States of America

James Krehbiel