Corning Incorporated

James Joseph Bernas

Kenneth Edward Hrdina

Lu Zhang

Bradley Frederick Bowden

Mark Andrew Stocker

John Joseph Costello, Iii

Jeffrey Michael Amsden

Margaret Helen Gentile

Yawei Sun

John Forrest Wight, Jr

Thomas William Brew

Weiguo Miao

Kenneth Richard Miller

Rodney I Frost

Sujanto Widjaja

David Robertson Treacy, Jr

Mark Lee Humphrey

Kenneth Charles Sariego

David William Folmar

Margaret H Gentile

John J Iii Costello

Mark A Stocker

An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates.

Method and apparatus for sealing a glass package

A honeycomb substrate includes an inner body having an inner skin and an array of inner webs defining an array of inner cells within the inner skin. The honeycomb substrate further includes an outer body having an outer skin formed concentric with the inner skin and an array of outer webs defining an array of triangle cells between the inner skin and the outer skin. The triangle cells are oriented along a radial direction with respect to a center of the inner body. An extrusion assembly for forming the honeycomb substrate includes an inner cell forming die, an outer cell forming die, and a skin forming mask, all mounted coaxially. An outer skin slot formed between the outer cell forming die and the skin forming mask is in communication with feedholes in the inner cell forming die through an opening in the outer cell forming die.

Extrusion die for making a double-skin honeycomb substrate

Extruded honeycomb products are formed by means of an extrusion die incorporating a pin support section positioned between the die body and the pin array forming the die discharge slots, the pin support providing enlarged support segments that improve pin stability and die resistance to pin damage without overly restricting batch flow through the die.

Honeycomb extrusion dies

A method for forming EUV LITHOGRAPHY GLASS STRUCTURES WITH VOIDS is disclosed which includes forming a slurry mixture including silica soot particles, and inserting the slurry mixture into a casting mold. The method provides low weight mass reduced rigid glass structures with beneficial thermal stability. The casting mold includes therein a casting form. The casting form is adapted to provide selected geometry void spaces within the glass lithography structure. The slurry mixture is dried to form a green ware object. The casting form is removed from the green ware and the green ware object is consolidated into a lithography glass structure with voids.

Method for making extreme ultraviolet lithography structures

A method of making an EUV lithography stage structure includes depositing a layer of a Ti doped SiO glass powder in a confined region to provide an underlying layer; applying a binder to form a primitive with the binder bonding the glass powder together at one or more selected regions; depositing an above layer of the glass powder above the deposited layer; applying the binder to the above layer with the binder bonding the glass powder together at one or more selected regions; repeating the deposition and binding steps to produce a number of successive layers with the binder bonding the successive layers together; and removing the unbonded glass powder to provide a bonded glass powder lithography stage structure which is then sintered and densified into a densified nonpowder glass lithography stage.

Solid freeform fabrication of lightweight lithography stage

Growing community of inventors

Horseheads, NY, United States of America

James Joseph Bernas