Kla Tencor Corporation

Zeta Instruments, Inc.

Core Tech Optical, Inc.

Uniphase Corporation

Ultrapointe Corporation

James Jianguo Xu

Ken K Lee

Ronny Soetarman

Rusmin Kudinar

Zhen Hou

Hung Phi Nguyen

Vamsi Mohan Velidandla

Ben Garland

Ronny Soetaman

James Nelson Stainton

Steven W Meeks

Budi Hartono

Bruce Worster

Nitigya Kathuria

John E Fertig

A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).

3D microscope including insertable components to provide multiple imaging and measurement capabilities

A dual mode inspector includes an optical inspector configured to detect a defect located at a first location on a sample, a microscope configured to capture an image of the defect at the first location on the sample, and a platform that is configured to support the sample. The sample is not removed from the platform between the detecting of the defect located at the first location on the sample and the capturing of the image of the defect at the first location on the sample. The dual mode optical inspector also includes a controller that causes the optical inspector to detect the defect located at the first location on the sample and causes the microscope to capture the image of the defect at the first location on the sample. The dual mode inspector also performs scanning lens distortion correction to improve the capturing of defect images.

Dual mode inspector

A method of generating 3D information includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across all pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; determining a second captured image that is focused on a second surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the first surface and the second surface.

Optical measurement of step size and plated metal thickness

A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.

3D microscope and methods of measuring patterned substrates

A method of generating 3D information including: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps; capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across a first portion of pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on an apex of a bump of the sample; determining a second captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the apex of the bump and the first surface.

Optical measurement of bump hieght

A method of generating 3D information of a sample using an optical microscope includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step, determining a characteristic value of each pixel in each captured image, determining a first captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image, and determining a measurement of an opening in the first surface of the sample based on the first captured image. The first surface of the sample and the second surface of the sample are within a field of view of each of the captured images. The first captured image includes a pattern overlay. In another example, the opening measurement is determined using a second captured image without a pattern overlay.

Optical measurement of opening dimensions in a wafer

A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.

Multi-surface optical 3D microscope

A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.

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San Jose, CA, United States of America

James Jianguo Xu