International Business Machines Corporation

James Jens Hansen

John M Lauffer

David John Russell

Bernd Karl Appelt

Irving Memis

Robin A Susko

Andrew Michael Seman

Ronald A Kaschak

Garey George Roden

Kenneth Andrew Wallace

Joseph Hromek

David K Balkin

Terry Chester Lahr

John Michael Gallagher

Magan S Patel

Lawrence C Alexander

David Robert Fletcher

A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.

Method of manufacture multilayer circuit package

A planar transformer wherein a conformal dielectric epoxy composition is provided on the planes containing the primary and secondary windings to encapsulate the windings and to insulate the windings from the perimeter of each plane to prevent the primary windings from electrically contacting the secondary windings around the edges of the planes. Also, a conformal dielectric epoxy composition separates the plane with the primary windings from the plane with the secondary windings from primary and secondary circuits directly and below windings.

Planar transformer and method of manufacture

Electric circuit card having a donut shaped land

Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.

Electrical and/or thermal interconnections and methods for obtaining such

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Huntington, IN, United States of America

James Jens Hansen