Endicott Interconnect Technologies, Inc.

James J McNamara, Jr

Voya Rista Markovich

John M Lauffer

Ashwinkumar C Bhatt

Varaprasad V Calmidi

Sanjeev Sathe

Rabindra N Das

David L Thomas

Peter A Moschak

Frank Daniel Egitto

Mark David Poliks

Subahu Dhirubhai Desai

Candido C Tiberia

Michael Hills

Thomas J Davis

An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package.

Electronic package with thermal interposer and method of making same

A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.

Circuitized substrate with dielectric interposer assembly and method

A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.

Anti-tamper microchip package based on thermal nanofluids or fluids

Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.

Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

A system and method for identifying and controlling the movement of various items, e.g., suitcases, associated with respective ones of various individuals, e.g., those desiring to travel on a selected means of transportation such as an airline, railway or the like. The system includes a plurality of programmable fingerprint readers each associated with a respective one of the items, a fingerprint scanner for scanning fingerprints from each individual and associating it with one or more of the items, a CPU for receiving readings from each of the item fingerprint readers and information from the scanner, and a retrieving unit (e.g., such as one owned by the transporting party) which retrieves selected ones of the fingerprint readings stored by the CPU for comparing with also retrieved readings from the respective fingerprint readers when the traveling individual presents an item to the transporting party for travel.

Item identification control method

A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.

Method for making a multilayered circuitized substrate

A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.

Method of making a printed circuit board with low cross-talk noise

A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.

Method of inspecting articles using imaging inspection apparatus with directional cooling

A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.

Method of making an imaging inspection apparatus with improved cooling

An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.

Imaging inspection apparatus with improved cooling

An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.

Imaging inspection apparatus with directional cooling

A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.

Growing community of inventors

Vestal, NY, United States of America

James J McNamara, Jr