International Business Machines Corporation

James J Hedrick

Krishna Gandhi Sachdev

Thomas J Walsh

Arthur Bross

Robert O Lussow

Robert D Johnson

Donald E Myers

James R Lyerla, Jr

Joseph D Peruffo

A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).

Single step electrical/mechanical connection process for connecting I/O

Growing community of inventors

Oakland, CA, United States of America

James J Hedrick