Applied Materials, Inc.

Avago Technologies International Sales Pte. Limited

James J Chen

Salvador P Umotoy

Lawrence Chung-Lai Lei

Joel M Huston

Anh Ngoc Nguyen

Fufa Chen

Hanh D Nguyen

John Vincent Schmitt

Keith K Koai

Steve H Chiao

Mark S Johnson

Yeh-Jen Kao

Geng Tian

Be Van Vo

Cuong C Nguyen

Hong Bee Teoh

Tung-Ching Tseng

Sean Li

An application launcher and management framework (ALM framework) is provided for enabling and managing the execution of external applications (e.g., third party applications) on a network device. The ALM framework enables external applications to be executed and managed on a network device based upon configuration information specified for the external applications. In certain embodiments, the ALM framework enables an external application to be executed within the network device's network operating system (NOS) as if the application was provided as part of the NOS. By enabling the external application to be integrated with the network device's NOS, the ALM framework enables several services provided by the NOS to be made available to the external application.

Application launcher and management framework for a network device

An apparatus for wafer processing, which comprises a chamber body and a heated liner which are thermally isolated from each other by isolating pins. During wafer processing, e.g., deposition of titanium nitride film by thermal reaction between titanium tetrachloride and ammonia, a wafer substrate is heated to a reaction temperature in the range of 600-700&deg; C. by a heated support pedestal. The chamber liner and the interior chamber walls are maintained at a temperature between 150-250&deg; C. to prevent deposition of undesirable by-products inside the chamber. This facilitates the chamber cleaning procedure, which can be performed using an in-situ chlorine-based process. The excellent thermal isolation between the heated liner and the chamber body allows the chamber exterior to be maintained at a safe operating temperature of 60-65&deg; C. A heated exhaust assembly is also used in conjunction with the process chamber to remove exhaust gases and reaction by-products. External heaters are used to maintain the exhaust assembly at a temperature of about 150-200&deg; C. to minimize undesirable deposits on the interior surfaces of the exhaust assembly.

High temperature chemical vapor deposition chamber

An apparatus and method for controlling a flow of process material to a deposition chamber. The apparatus comprises an injector valve, disposed between the process material source and the deposition chamber. The injector valve controls the flow of precursor material by repeatedly opening and closing the injector valve with a predetermined duty cycle. The apparatus further comprises an evaporator coupled to the injector valve for evaporating the precursor.

Apparatus and method for controlling a flow of process material to a deposition chamber

A pedestal heating system provided for heating a pedestal disposed in the processing chamber of a substrate processing system. A pedestal heating system according to the present invention includes: a heater power supply, a transformer, coupled to the heater power supply, a heater element coupled to the transformer, and an RF ground electrode. The transformer is configured to reduce leakage current from the heater element to various elements of the substrate processing system by localizing current leakage loops. The heater element and RF ground electrode are disposed within the pedestal. Preferably, the transformer is simply an isolation transformer. Where an RF energy source is used, such as in a plasma CVD processing system, an EMI filter may be coupled between the transformer and the heater element, or at another point in the power supply chain to prevent feed-through of RF energy to other of the substrate processing system's subsystems, or other sensitive electronic circuitry coupled to the facility's power supply.

Prevention of ground fault interrupts in a semiconductor processing

A vacuum processing system is provided with a programmable interlock circuit for combining the interlock signals generated by the system into combined interlock signals. The programmable interlock circuit uses a matrix of switches to select which interlocks will be combined to form which combinations. The interlock signals are formed by two lines that are shorted together when the interlock signal is okay and not shorted together when the interlock signal is not okay. When the two lines are shorted together, then they activate a relay to send a signal in a line of relays, each of which is activated by a different interlock signal. The matrix of switches short out the relay switches in order to deselect one interlock input for one interlock output. Each interlock signal is associated with an LED for visual indication of whether the interlock is okay. Likewise, each combined interlock signal is associated with an LED for visual indication of whether the combination of interlocks is okay. Additionally, each interlock signal is associated with a defeat circuit wherein a jumper may defeat the interlock signal for every combination. Each defeat circuit is provided with an LED for visual indication of whether the interlock is defeated.

Programmable electrical interlock system for a vacuum processing system

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San Jose, CA, United States of America

James J Chen