Kemet Electronics Corporation

The Penn State Research Foundation

James J Beeson

Michael Randall

Azizuddin Tajuddin

Pascal I Pinceloup

Ian Burn

Abhijit Gurav

Daniel E Barber

Corey Antoniades

Xilin Xu

Thomas Poole

Daniel J Skamser

Clive A Randall

Susan Trolier McKinstry

Hajime Nagata

Pascal G Pinceloup

The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiOmultilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiOdielectric layers and LaNiOinternal electrodes are prepared, enabling dielectric layer thicknesses of 1 &#x3bc;m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.

Microcontact printed thin film capacitors

A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula:{[(CaO)(SrO)][(ZrO)(TiO)]}AE

C0G multi-layered ceramic capacitor

A dielectric ceramic, and capacitor with the ceramic, wherein the ceramic has: about 94&#x2013;99.9 wt % a first component defined by Formula 1;[(CaSr)O](ZrTi)OFormula 1wherein:

Dielectric ceramic capacitor comprising non-reducible dielectric

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Simpsonville, SC, United States of America

James J Beeson