Avago Technologies Fiber IP (singapore) Pte. Ltd

Agilent Technologies, Inc.

James Howard Williams

Brenton Arthur Baugh

Robert E Wilson

Kendra J Gallup

Robert H Yi

James A Matthews

Richard A Ruh

Tak Kui Wang

Christopher L Coleman

Tanya Jergeris Snyder

In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Passive alignment using elastic averaging in optoelectronics applications

An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Optical device package with turning mirror and alignment post

An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Axis translation installation mechanism for optoelectronics modules and method

A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Surface emitting laser package having integrated optical element and alignment post

Axis translation installation mechanism for optoelectronic modules

An optoelectronic assembly includes an optical lens element (OLE) coupled to a substrate. The substrate includes a transducer, a standing structure on the transducer, a transducer lens supported by the standing structure over the transducer, and alignment features. The OLE includes an OLE lens and co-alignment features that couple with the alignment features on the optoelectronic assembly. When the substrate is coupled to the OLE, the transducer lens is aligned with the OLE lens.

Optoelectronic assembly with coupling features for alignment

A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Wafer-level packaging of optical receivers

A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

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Walnut Creek, CA, United States of America

James Howard Williams