Cooligy, Inc.

Liebert Corporation

Vertiv Corporation

James Hom

Richard Grant Brewer

Douglas E Werner

Norman Chow

Brandon R Leong

Mark McMaster

Girish Upadhya

Adrian Correa

Tien Chih (Eric) Lin

Peng Zhou

Tien-Chih Lin

Hae-won Choi

Gregory Shiomoto

Kenneth E Goodson

Mark Munch

Paul Tsao

Richard A Herms

Sudhakar Gopalakrishnan

Bruce R Conway

Tien-Chieh (Eric) Lin

A pumped refrigerant cooling system having cooling units with associated pumping units for providing working fluid to the cooling unit to enable cooling of a space. The pumped refrigerant cooling system also includes a redundant pumping unit which is activated when a primary pumping unit associated with a cooling unit becomes inactive. The primary pumping unit is deactivated in favor of the redundant pumping unit. Once the primary pumping unit is placed in a condition suitable for reactivation, the redundant pumping unit is deactivated, and the primary pumping unit is reactivated.

Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy

A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes multiple heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes one or more swivel joints, each configured to provide one or more fluid paths between the cooling door and the frame. The cooling door assembly includes separate and independent fluid paths, where fluid is separately provided to each independent fluid path. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.

Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door

A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.

An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

Integrated liquid to air conduction module

A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with a highly thermally conductive material and sized to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels.

Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange

The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

Internal access mechanism for a server rack

A cooling system is used to cool heat generating devices within a personal computer. The cooling system has a first fluid loop and an expandable array of one or more second fluid loops. For each of the second fluid loops, heat generating devices transfer heat to fluid flowing through corresponding heat exchanging devices in the loop. Heat is transferred from the fluid in each second fluid loop to a thermal bus of the first fluid loop via a thermal interface. The second fluid loop can be a pumped fluid loop or can include a heat pipe. Within the first fluid loop, a fluid is continuously pumped from the thermal bus to a fluid-to-air heat exchanging system and back to the thermal bus. Heat transferred to the thermal bus from the first fluid loop is transferred to the fluid in the second fluid loop passing through the thermal bus. The heated fluid is pumped through the fluid-to-air heat exchanging system where the heat is transferred from the fluid to the ambient. The thermal bus provides a modular, scalable cooling system which allows for the expansion of cooling capacity without breaking the fluid lines.

Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers

A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.

Growing community of inventors

Redwood City, CA, United States of America

James Hom