Applied Materials, Inc.

James Hoffman

Hong Soon Kim

Beom Soo Park

John M White

Soo Young Choi

Atsushi Kitani

Kyung-Tae Kim

Makoto Inagawa

Hongbin Ji

Sam Hyungsam Kim

Takayuki Matsumoto

Billy C Leung

Toshio Kiyotake

Inchen Huang

William Allan Bagley

Paohuei Lee

Sam-Kyung Kim

Jonathan Erik Larson

Suhail Anwar

Chia-Hung Chen

Young Kwon

Jaeyoung Kim

Hsin-Hsien Wu

The present disclosure generally relates to methods and apparatus for heating a substrate as well as a slot management method for a thermal treatment chamber that in one embodiment includes providing a first substrate to a first slot of a carrier in the thermal treatment chamber via a transfer opening formed in the thermal treatment chamber, the first substrate having a specified anneal time, heating the substrate, moving the carrier to a lowermost position in the thermal treatment chamber using an elevator mechanism coupled to the carrier, and moving the carrier such that the first slot is in a position adjacent to the transfer opening using the elevator mechanism within a carrier transfer time period and transferring the first substrate out of the thermal treatment chamber at a determined time period for anneal.

Method and apparatus for substrate transfer in a thermal treatment chamber

Implementations described herein generally relate to a method and apparatus for processing substrates in a processing system. The method includes identifying, in a buffer chamber coupled to a transfer chamber of a processing system, a first substrate that has been in the buffer chamber longer than a predetermined duration and identifying a first destination chamber of the processing system for the first substrate. After identifying the first substrate, a buffer chamber time-out operation is performed. The buffer time out operation includes suspending movement of substrates from a load lock chamber to the transfer chamber and removing the first substrate from the buffer chamber.

Method and apparatus for handling substrates in a processing system having a buffer chamber

Systems, methods, and apparatus are provided for operating a cluster tool including receiving recipe time data; receiving transfer time data; receiving process programs and associated substrate lots wherein the process programs include a plurality of sequences; determining cluster tool chambers associated with sequences that are bottleneck sequences; setting equipment constant values for components of the cluster tool to implement transfer priorities wherein the chambers associated with bottleneck sequences are given highest priority; executing a next sequence based on the transfer priorities; and repeating the determining, setting and executing for each remaining sequence. Numerous additional aspects are disclosed.

Dynamic routing control methods and systems for a cluster tool

Malfunction of a component within an RF-powered plasma chamber is detected by observing an operating condition of the plasma chamber and detecting when the operating condition deviates from a previously observed range bounded by lower and upper limits. The lower and upper limits are determined by observing the minimum and maximum values of that operating condition during the processing of workpieces throughout one or more plasma chamber cleaning cycles immediately preceding the most recent cleaning of the plasma chamber.

Detecting plasma chamber malfunction

The present invention generally relates to a method for flexible process condition monitoring. In a process that utilizes RF power, the RF power may be applied at different levels during different points in the process. Software may be programmed to facilitate the monitoring of the different points in the process so that the acceptable deviation range of the RF power for each point in the process may be set to different values. For example, one phase of the process may permit a greater range of RF power deviation while a second phase may be much more particular and permit very little deviation. By programming software to permit each phase of the process to be uniquely monitored, a more precise RF process may be obtained.

Flexible process condition monitoring

Abnormal conditions within an RF-powered plasma process chamber are detected by detecting whether the frequency of a variable-frequency RF power supply moves outside established lower and upper limits. In a first aspect, a first pair of lower and upper limits are established as a function of the frequency of the power supply sampled after a new process step begins or after a sample control signal changes state. In a second aspect, a second pair of lower and upper limits are not adapted to the frequency of the power supply. Both aspects preferably are used together to detect different occurrences of abnormal conditions.

Frequency monitoring to detect plasma process abnormality

An apparatus and method incorporating at least two sensors that detect the presence of a substrate is provided. In one embodiment, a method for transferring a substrate in a processing system is described. The method includes positioning a substrate on an end effector in a first chamber, moving the substrate through an opening between the first chamber and a second chamber along a substrate travel path, and sensing opposing sides of the substrate travel path using at least two sensors positioned proximate to the opening, each of the at least two sensors defining a beam path that is directed through opposing edge regions of the substrate when at least a portion of an edge region traverses the beam path.

Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate

In some aspects, a method is provided for enhancing electronic device manufacturing throughput within an electronic device manufacturing tool. The method includes the steps of (1) for the electronic device manufacturing tool, creating an electronic device manufacturing schedule based on process factors and mechanical factors associated with the manufacturing tool; and (2) employing the electronic device manufacturing schedule during electronic device manufacturing within the electronic device manufacturing tool. Numerous other aspects are provided.

Methods and apparatus for enhancing electronic device manufacturing throughput

Methods, systems, and apparatus are provided that include determining a number of storage locations corresponding to busy chambers of an electronic device manufacturing tool; based on the number of storage locations corresponding to busy chambers, determining whether the electronic device manufacturing tool may accommodate a substrate; and of the electronic device manufacturing tool may accommodate a substrate, receiving a substrate in the electronic device manufacturing tool. Numerous other aspects are provided.

An apparatus and method incorporating at least two sensors that detect the presence of substrate defects, such as breakage or misalignment, along the lengths of at least two parallel edges of a moving substrate. In one embodiment, an apparatus for detecting substrate defects includes a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors. In another embodiment, an apparatus for detecting substrate defects includes a robot having a substrate support surface, and a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate during substrate transfer on the substrate support surface. In another embodiment, a method of continuously detecting substrate defects includes positioning at least two sensors to continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors, and transmitting a signal from each of the at least two sensors to a controller that continuously monitors the signals from the at least two sensors to detect the presence of a substrate defect.

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San Jose, CA, United States of America

James Hoffman