Powerwave Technologies, Inc.

L3 Technologies, Inc.

James Hiram Roberson

William Kerr Veitschegger

Loren E Ralph

James Keith Custer

Eddie Rodgers

Ken Wong

A satellite is configured for use in space so as to receive RF signals, convert them to a different frequency range, and retransmit the converted RF signals. The satellite comprises a payload area supporting a motherboard structure with a plurality of frequency converters supported on it. The frequency converters are each connected with an antenna system of the satellite so that each of them receives a respective RF input signal. A local oscillator source supported on said motherboard structure generates a local oscillator signal, and a motherboard in the motherboard structure receives the local oscillator signal and transmits it through the motherboard to each of the frequency converters. The frequency converters each convert the respective RF input signal to a respective RF output signal using the local oscillator signal and transmit the RF output signal to the antenna system so as to be transmitted wirelessly.

Method and system for satellite using multifunctional motherboard

A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a circuit board from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board and solder applied to the pins at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections between the pins and conductive traces on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.

Method for assembling a circuit board apparatus with pin connectors

An electronics assembly incorporating an interconnect includes a conductive gasket disposed between a first printed circuit board and a second printed circuit board. The gasket surrounds, and thereby shields, the interconnect while providing an RF ground connection between the two boards with a controlled RF impedance. The second printed circuit board may serve as a connector board for a plurality of modules, or other printed circuit boards, to be coupled thereto. Each module is individually covered with a separate lid. Methods for manufacturing and assembling structures according to the invention are also provided.

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Placerville, CA, United States of America

James Hiram Roberson