Other

Intevac, Inc.

James H Rogers

Terry Bluck

Jun Xie

Sean P McGinnis

Eric C Lawson

Brian Hoffman

Cutting assemblies are disclosed that include an entrance portion and a receiving portion, with the receiving portion defining a receiving opening configured to be axially aligned with an entrance opening of the entrance portion when mounted to the surface of a cutting apparatus. Cutting assemblies are also provided that include a material carriage configured to be borne by a cutting apparatus. Cutting assemblies that include a material receiving portion configured to be slidably mounted to a surface of a cutting apparatus are also disclosed. Cutting methods are also disclosed that can include rotating a piece of material around the materials longitudinal axis and delivering the material to a cutting tool while the longitudinal axis of the material is aligned substantially opposite the direction of rotation of the cutting tool.

Cutting assemblies and methods

A rod end device is disclosed for a motor vehicle. The device includes a ball having an outer surface, the ball defining a supporting bore that extends through the ball. A race is provided for bearingly supporting the ball, the race defining a groove which is in fluid communication with the outer surface of the ball. A rod end supports the race, the rod end defining a channel which is in fluid communication with the groove. A one way valve is connected to the channel for supplying lubricant to the channel.

Rod end device for a motor vehicle

Described is a cooling system for use in the manufacture of substrates into magnetic disk memory in which cooling plates are positioned dynamically in relation to a substrate to be cooled. This enables positioning the cooling plates closer for more effective cooling. Positioning is controlled by capacitive measurements between the cooling plates and the substrate to be cooled.

Capacitance sensing for substrate cooling

A substrate processing system includes a processing chamber, an electrically floating substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, at least one ion source located in the chamber, and a power source for energizing the ion source by positively biasing the anode and negatively biasing the cathode in a train of pulses of selectably variable duty cycle and magnitude to maintain a selected time averaged current, the bias in each instance being relative to the chamber. The ion source ionizes the process gas producing ions for processing a substrate disposed on the floating substrate holder in the chamber. The floating substrate is biased in accord with the net charge thereon as controlled by the energetic electron flux. One embodiment includes two such ion sources. In this case, the power source energizes the first and second anodes and the cathodes in a time multiplexed manner, such that only one of the first or second ion sources is energized at any time and interactions between ion sources are eliminated.

Plasma processing system and method

A disk gripper for gripping an insulating disk, such as a glass disk, at its edge during processing includes a contact device for contacting the edge of the insulating disk and a mechanism for moving the contact device between a contact position, in contact with the edge of the disk, and a retracted position. In a first processing station, a conductive coating is applied to a disk held by the gripper, with the contact device in the retracted position. In a second processing station, ions are generated in a plasma adjacent to the surface of the disk held by the gripper. The contact device is in the contact position in contact with the conductive coating, and a bias voltage is applied to the contact device in the second processing station. The ions are accelerated from the plasma toward the disk by the bias voltage applied to the conductive coating.

Methods and apparatus for processing insulating substrates

A substrate processing system includes a processing chamber, a substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, first and second ion sources located in the chamber, and a power source for energizing the first and second ion sources. Each ion source ionizes the process gas to produce ions for processing a substrate disposed on the substrate holder. The first and second ion sources include first and second anodes, respectively. The power source energizes the first and second anodes in a time multiplexed manner, such that only one of the first and second ion sources is energized at any time and interactions between ion sources are eliminated.

Processing systems with dual ion sources

A substrate processing system includes a processing chamber, a substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, at least one ion source located in the chamber, and a power source for energizing the ion source by positively biasing the anode and negatively biasing the cathode, the bias in each instance being relative to the chamber. The ion source ionizes the process gas producing ions for processing a substrate disposed on a substrate holder in the chamber. One embodiment includes two such ion sources. In this case, the power source energizes the first and second anodes and the cathodes in a time multiplexed manner, such that only one of the first or second ion sources is energized at any time and interactions between ion sources are eliminated.

An orienting device or more specifically a tilting mechanism designed to be used primarily with selectively maneuverable pick-up heads of the type used to handle large baskets in the loading and general harvesting of citrus products and the like. The orienting device comprises a frame having a fluid activated piston and cylinder assembly interconnected between the frame and a lever arm attached to the rotary shaft of the pick-up head whereupon activation of the piston and cylinder assembly, rotation of the lever arm and attached rotary shaft causes tilting or predetermined orientation of the pick-up head. The entire frame and the attached rotary shaft pivots about a pivot shaft serving also as the point of interconnection of the supporting boom, and located above and spaced from the rotary shaft of the pick-up head.

Growing community of inventors

Santa Clara, CA, United States of America

James H Rogers