Motorola Corporation

James H Lombard

Rong-Fong Huang

Carlos Anthony Sanchez

Leonard J Anderson

Rong F Huang

Ming-Yih Su

A dielectric paste material may be used in the fabrication of multilayered ceramic modules to create circuit elements. The dielectric paste is a multiphase material in which at least one phase is an alkaline earth metal, transition metal silicate. This yields a dielectric paste with extremely good K & Q values suitable for high frequency applications which significantly reduce manufacturing costs of modules.

Low temperature cofireable dielectric paste

A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.

High adhesion, solderable, metallization materials

An electrically resistive film of the type used for forming thick film resistors is formed predominantly of palladium and includes an addition of boron nitride to increase resistance, preferably in combination with tantalum oxide. A paste of palladium powder and boron nitride powder dispersed in a vaporizable vehicle is applied to a substrate and sintered to form the film. In a preferred embodiment, the substrate is a ceramic powder compact that is concurrently sintered in a co-firing process.

Palladium thick film resistor containing boron nitride

A palladium paste is utilized for forming a palladium film on a ceramic substrate. The paste includes a sinterable palladium powder dispersed in a vaporizable liquid vehicle. The paste also includes minor additions of titanium dioxide powder and a metal titanate powder. A preferred titanate powder is composed of strontium calcium titanate. It is found that the additions remarkably improve adhesion of the palladium film to the substrate.

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Albuquerque, NM, United States of America

James H Lombard