Texas Instruments Corporation

James H Howser

Tom L Fowler

A multi-component electronic assembly (,) including a leadframe (,) having upper and lower surfaces and a plurality of conductive leads (,). Each lead (,) has first bonding surfaces (,) on the upper surface of each lead and second bonding surfaces (,) on the lower surface of each lead (,). Preferably, each lead has a plurality of third bonding surfaces (,) formed on at least some of the plurality of leads where the third bonding surfaces (,) are formed by conductive extensions of the leads (,) that extend towards the center of the assembly (,). A first passive component (,) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (,) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (,) are used, a third component (,) is electrically and mechanically coupled to the third bonding surfaces (,).

Integrated circuit with tightly coupled passive components

A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfaces (201) on the lower surface of each lead (203). Preferably, each lead has a plurality of third bonding surfaces (202) formed on at least some of the plurality of leads where the third bonding surfaces (202) are formed by conductive extensions of the leads (203) that extend towards the center of the assembly (100). A first passive component (102) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (104) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (202) are used, a third component (103) is electrically and mechanically coupled to the third bonding surfaces (202).

Growing community of inventors

Richardson, TX, United States of America

James H Howser