International Test Solutions, Inc.

Chemsultants International Inc.

James H Duvall

Alan Eugene Humphrey

Jerry J Broz

Bret A Humphrey

Berryinne Decker

Pasco R Santurri

Denise M Katona

Joseph T Mausar

A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

Wafer manufacturing cleaning apparatus, process and method of use

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.

Working surface cleaning system and method

A cleaning material for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, has a cleaning pad layer, one or more intermediate layers having a set of predetermined characteristics and having a plurality of abrasive particles.

Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware

A multilayered membrane for use with fuel cells and related applications. The multilayered membrane includes a carrier film, at least one layer of an undoped conductive polymer electrolyte material applied onto the carrier film, and at least one layer of a conductive polymer electrolyte material applied onto the adjacent layer of polymer electrolyte material. Each layer of conductive polymer electrolyte material is doped with a plurality of nanoparticles. Each layer of undoped electrolyte material and doped electrolyte material may be applied in an alternating configuration, or alternatively, adjacent layers of doped conductive polymer electrolyte material is employed. The process for producing a multilayered composite membrane includes providing a carrier substrate and solution casting a layer of undoped conductive polymer electrolyte material and a layer of conductive polymer electrolyte material doped with nanoparticles in an alternating arrangement or in an arrangement where doped layers are adjacent to one another.

Multilayered composite proton exchange membrane and a process for manufacturing the same

A cleaning device for cleaning pin contact elements and support hardware in a semiconductor testing apparatus that has a cleaning layer with a predetermined configuration appropriate for the particular pin contact elements and a substrate having a configuration to be introduced into the testing apparatus during the normal testing operating of the testing apparatus. The cleaning layer secured to the substrate has predetermined characteristics that cause the pad to clean debris the pin contact elements and support hardware when the pin contact elements and support hardware contact the pad during the normal operation of the testing machine.

A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.

Growing community of inventors

Reno, NV, United States of America

James H Duvall