Other

Applied Materials, Inc.

The Boc Group, Inc.

Von Ardenne Anlagentechnik Gmbh

Applied Films Corporation

James G Rietzel

Peter A Sieck

Leszek Malaszewski

Christopher P Woolley

Kevin D Johnson

Norman E Allen

An apparatus and method for controlling local deposition rate in a physical vapor deposition process is provided. A magnet bar assembly is disposed inside a sputtering target. The magnet bar assembly comprises a magnet bar, a support member aligned with the magnet bar, and one or more sliding brackets that couple the support member to the magnet bar. Each sliding bracket compresses the magnet bar to the support member, allowing the use of spacers between the support member and the magnet bar to adjust local proximity of the magnet bar to the plasma bombarding the target.

Magnet bar support system

A system for providing a seal between a rotating part and a stationary part that comprises two seals in series separated by a cavity is disclosed. The cavity may be at low pressure and failure of either seal may be detected by a change in cavity pressure. An alarm may be triggered when cavity pressure rises above a threshold, or when it remains above a threshold for more than a predetermined period of time. In a system comprising multiple cavities, a cavity may be selectively isolated to determine if a seal associated with that cavity is experiencing a leak.

Method for differentially pumping endblock seal cavity

A cylindrical magnetron capable of running at high current and voltage levels with a target tube that is self cleaning not only in the center portion, but also at the ends. Sputtering the ends of the target tube virtually eliminates accumulation of condensate at the ends and any resultant arcing, resulting in a more reliable magnetron requiring less service and a magnetron that produces more consistent coatings.

Cylindrical magnetron with self cleaning target

The use of a gas injector including a dielectric material around the ports has an advantage when used with plasma enhanced chemical vapor deposition in that a plasma torch will not be formed at the gas injector and the gases will not dissociate prematurely. This adds to the quality of the coatings and allows the system to be used at higher amperage and thus improved line speeds. The use of a dielectric plug at the ports allows the ports to be easily serviced and replaced.

Gas injector for plasma enhanced chemical vapor deposition

An improved shield structure for use in a sputtering apparatus for depositing a film on a substrate is disclosed. The cylindrically shaped shield structure, which extends over the ends of a cylindrical sputtering target, has at least one annular structure extending around an outside surface of the shield. The annular structure is dimensioned to interrupt or suppress movement of any arc which might otherwise travel across its outside surface. In a preferred embodiment, the annular structure is a groove capable of trapping any such arc therein and preventing its escape therefrom. In another preferred embodiment, the improved shield structure is electrically isolated such that it is prevented from becoming an anode. In this manner, the electrically isolated shield structure inhibits the formation of severe arcs between it and the cathodic target. Further, with its arc-suppressing annular structure, the electrically isolated shield structure inhibits movement of any such severe arcs which might otherwise travel across the shield surface toward the support blocks, the vacuum chamber or other anode.

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Antioch, CA, United States of America

James G Rietzel